Interconnects for a multi-layer three-dimensional silicon architecture

Microwave Journal

Volumn 44, Issue 5, 2001, Pages

  Herrick, K J ^a   Katehi, L P B ^a   Kihm, R T ^a  

^a University of Michigan   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON MICROMACHINING; WILKINSON DIVIDERS;

ELECTRONICS PACKAGING; INSERTION LOSSES; INTEGRATED CIRCUIT LAYOUT; MARKETING; MICROMACHINING; MULTILAYERS; SEMICONDUCTING SILICON;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 17444454331     PISSN: 01926225     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (23)

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18. Interconnects for a multi-layer three-dimensional silicon architecture