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Volumn 1, Issue , 2000, Pages 73-76

RF W-band wafer-to-wafer transition

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL SIGNALS; FINITE GROUND COPLANAR LINE; MULTIWAFER SILICON;

EID: 0033694610     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (9)

References (10)
  • 1
    • 0031177094 scopus 로고    scopus 로고
    • Low temperature intermediate au-si wafer bonding; Eutectic or silicide bond
    • RE Wolffenbutel, "Low Temperature Intermediate Au-Si Wafer Bonding; Eutectic or Silicide Bond," Sensors and Actuators A, vol. 62, pp. 680-686, 1997.
    • (1997) Sensors and Actuators A , vol.62 , pp. 680-686
    • Wolffenbutel, R.E.1
  • 2
    • 0028429727 scopus 로고
    • Low temperalure silicon wafer-to-wafer bonding using gold at eutectic temperature
    • RE Wolffenbutel and KD. Wise, "Low Temperalure Silicon Wafer-to-Wafer Bonding using Gold at Eutectic Temperature," Senson. and Actuators A, vol. 43, pp. 223-229, 1994.
    • (1994) Senson. and Actuators A , vol.43 , pp. 223-229
    • Wolffenbutel, R.E.1    Wise, K.D.2
  • 3
    • 11544359083 scopus 로고    scopus 로고
    • Silicon wafer bonding: Key to MEMS High-volume manufacturing
    • December
    • A.R Mirza and A.A. Ayon, "Silicon Wafer Bonding: Key to MEMS High-Volume Manufacturing," Season., vol. 15, no. 12, December 1998.
    • (1998) Season , vol.15 , Issue.12
    • Mirza, A.R.1    Ayon, A.A.2
  • 4
  • 5
    • 79952626288 scopus 로고    scopus 로고
    • Ansoft Maxwell 2D-3D. Release 1.9, 1998
    • Ansoft Maxwell 2D-3D. Release 1.9, 1998.
  • 6
    • 79952617885 scopus 로고    scopus 로고
    • Ansoft Maxwell HFSS Release 6, 1998
    • Ansoft Maxwell HFSS Release 6, 1998.
  • 7
    • 0016557114 scopus 로고
    • Effect of surface contamination on the thermocompression bondability of gold
    • J.L. Jellison, "Effect of Surface Contamination on the Thermocompression Bondability of Gold," IEEE Transactions on Parts, Hybrids, and Packaging, vol. PHP-11, no. 3, pp. 206-211, 1975.
    • (1975) IEEE Transactions on Parts, Hybrids, and Packaging , vol.PHP-11 , Issue.3 , pp. 206-211
    • Jellison, J.L.1
  • 8
    • 0017505710 scopus 로고
    • Kinetics of thermocompression bonding to organic contaminated gold surfaces
    • J.L. Jellison, "Kinetics of Thermocompression Bonding to Organic Contaminated Gold Surfaces," IEEE Transactions on Parts. Hybrids, and Packaging, vol. PHP-13, no. 2, pp. 132-137, 1977
    • (1977) IEEE Transactions on Parts. Hybrids, and Packaging , vol.PHP-13 , Issue.2 , pp. 132-137
    • Jellison, J.L.1
  • 9
    • 0026188064 scopus 로고
    • A multiline method of network analyser calibration
    • July
    • R B. Marks, "A Multiline Method of Network Analyser Calibration," IEEE Transactions on Microwave Theory and Techniques, vol. 39, no. 7, pp. 1205-1215, July 1991.
    • (1991) IEEE Transactions on Microwave Theory and Techniques , vol.39 , Issue.7 , pp. 1205-1215
    • Marks, R.B.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.