Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2001, Pages 153-157

  Jiang, L ^a   Koo, J M ^a   Zeng, S ^a   Mikkelsen, J C ^a   Zhang, L ^a   Zhou, P ^a   Santiago, J G ^a   Kenny, T W ^a   Goodson, K E ^a  

^a Stanford University   (United States)

Author keywords

Elelectrokinetic pump; IC cooling technology; Microchannel heat sinks; Two phase heat transfer

Indexed keywords

ALUMINUM; COOLING; HEAT RESISTANCE; HEAT SINKS; INTEGRATED CIRCUIT MANUFACTURE; OPTIMIZATION;

ELECTROKINETIC PUMPS;

VLSI CIRCUITS;

EID: 0035020722     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)