Silicon-based micromachined packages for high-frequency applications

IEEE Transactions on Microwave Theory and Techniques

Volumn 47, Issue 8, 1999, Pages 1563-1569

  Henderson, Rashaunda M ^a   Katehi, Linda P B ^b  

^a MOTOROLA INC   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; MICROMACHINING; SEMICONDUCTING SILICON;

HIGH FREQUENCY ELECTRONIC CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0032675889     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.780409     Document Type: Article

References (14)

1. J. E. Sergent and C. A. Harper, Eds., Hybrid Microelectronics Handbook, 2nd ed. New York: McGraw-Hill, 1995.
2. J. G. Yook, L. P. B. Katehi, R. N. Simons, and K. A. Shalkhauser, "Experimental and theoretical study of parasitic leakage/resonance in a A'/A'a-band MMIC package," IEEE Trans. Microwave Theory Tech., vol. 44, pp. 2403-2410, Dec. 1996.
3. R. R. Tummala and E. J. Rymaszewski, Eds., Microelectronics Packaging Handbook. New York: Van Nostrand, 1989.
4. M. I. Herman, K. A. Lee, A. Kolawa, L. E. Lowry, and A. N. Tulintseff, "Novel techniques for millimeter-wave packages," IEEE Trans. Microwave Theory Tech., vol. 43, pp. 1516-1523, July 1995.
5. R. F. Drayton and L. P. B. Katehi, "Development of self-packaged high frequency circuits using micromachining techniques," IEEE Trans. Microwave Theory Tech., vol. 43, pp. 2073-2080, Sept. 1995.
6. S. V. Robertson, L. P. B. Katehi, and G. M. Rebeiz, "Micromachined self-packaged W-band bandpass filters," in IEEEMTT-SInt. Symp. Dig., 1995, pp. 1543-1546.
7. K. E. Petersen, "Silicon as a mechanical material," Proc. IEEE, vol. 70, pp. 42057, May 1982.
8. A. C. M. Gieles and G. H. J. Somers, "Miniature pressure transducers with silicon diaphragm," Philips Tech. Rev., vol. 33, p. 14, 1973.
9. T. M. Weller, L. P. B. Katehi, and G. M. Rebeiz, "High performance microshield line components," IEEE Trans. Microwave Theory Tech., vol. 43, pp. 534-543, Mar. 1995.
10. T. R. Gheewalla, "Packages for ultra-high speed GaAs IC's," in Proc. GaAs Symp., 1984, p. 184.
11. C. C. Huang, private communication, 1995.
12. S. V. Robertson, "Micromachined W-band circuits," Ph.D. sdissertation, Univ. Michigan at Ann Arbor, Ann Arbor, MI, 1997, pp. 111-114.
13. R. F. Drayton, "The development and characterization of self-packages using micromachining techniques for high frequency applications," Ph.D. dissertation, Univ. Michigan at Ann Arbor, Ann Arbor, MI, 1995, pp. 69-73.
14. R. M. Henderson, "Silicon-based micromachined packaging techniques for high-frequency applications," Ph.D. dissertation, Dept. Elect. Eng., Univ. Michigan at Ann Arbor, Ann Arbor, MI, 1999.