Cross-sectional atomic force microscopy imaging of polycrystalline thin films

Ultramicroscopy

Volumn 85, Issue 2, 2000, Pages 61-71

  Ballif, C ^a   Moutinho, H R ^a   Hasoon, F S ^a   Dhere, R G ^a   Al Jassim, M M ^a  

^a NATIONAL RENEWABLE ENERGY LABORATORY   (United States)

Author keywords

Atomic force microscopy; Cross section; Polycrystalline film; Scanning electron microscopy

Indexed keywords

COPPER COMPOUNDS; FRACTURE; GLASS; HETEROJUNCTIONS; IMAGING TECHNIQUES; MOLYBDENUM; POLYCRYSTALLINE MATERIALS; SEMICONDUCTING CADMIUM TELLURIDE; SEMICONDUCTING FILMS; SEMICONDUCTING TIN COMPOUNDS; SILICON WAFERS; ZINC OXIDE;

CADMIUM SULFIDE; TIN DIOXIDE; TUNGSTEN OXIDE;

ATOMIC FORCE MICROSCOPY;

ARTICLE; ATOMIC FORCE MICROSCOPY; COMPARATIVE STUDY; CRYSTAL; FILM; IMAGING; INTEGRATED CIRCUIT; SCANNING ELECTRON MICROSCOPY;

EID: 0034307898     PISSN: 03043991     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0304-3991(00)00043-7     Document Type: Article

References (33)

1. Hirayama H., Koike M., Einaga Y., Shibata A., Takayanagi K. Phys. Rev. B. 56:1997;1948.
2. Siemens B., Domke C., Ebert Ph., Urban K. Phys. Rev. B. 56:1997;12321.
3. Harper J., Weimer M., Zhang D., Lin C.-H., Pei S.S. Appl. Phys. Lett. 73:1998;2805.
4. Nosho B.Z., Weinberg W.H., Barvosa-Carter W., Bennett B.R., Shanabrook B.V., Whitman L.J. Appl. Phys. Lett. 74:1999;1704.
5. Smith A.R., Chao K.J., Shih C.K., Shih Y.C., Streetman B.G. Appl. Phys. Lett. 66:1995;478.
6. Zuo S.L., Bi W.G., Tu C.W., Yu E.T. Appl. Phys. Lett. 72:1998;2135.
7. Goldman R.S., Feenstra R.M., Silfvenius C., Stälnacke B., Landgren G. J. Vac. Sci. Technol. B. 15:1997;1027.
8. Caragianis-Broadbridge C., Blaser J.M., Paine D.C. J. Appl. Phys. 82:1997;1626.
9. Castell M.R., Howie A., Ritchie D.A. Acta Mater. 46:1998;579.
10. Chen H., Feenstra R.M., Goldman R.S., Silfvenius C., Landgren G. Appl. Phys. Lett. 72:1998;1727.
11. Ankudinov V., Titkov A.N., Shubina T.V., Ivanov S.V., Kop'ev P.S., Lugauer H.-J., Reuscher G., Keim M., Waag A., Landwehr G. Appl. Phys. Lett. 75:1999;2626.
12. Dwir B., Reinhardt F., Biasiol G., Kapon E. Mater. Sci. Eng. B. 37:1996;83.
13. Wüllner D., Chahoud M., Schrimpf T., Bönsch P., Wehmann H.-H., Schlachetzki A. J. Appl. Phys. 85:1999;249.
14. Ye W., Drozd B., Hasan M.A., Poler J.C. Mater. Res. Soc. Proc. 466:1997;63.
15. Yu E.T. Mater. Sci. Eng. R. 17:1996;147.
16. Wilder K., Quate C.F., Singh B., Alvis R., Arnold W.H. J. Vac. Sci. Technol. B. 14:1996;4004.
17. Zavyalov V.V., McMurray J.S., Williams C.C. Rev. Sci. Instr. 70:1999;158.
18. Neubauer G., Erickson A., Williams C.C., Kopanski J.J., Rodgers M., Adderton D. J. Vac. Sci. Technol. B. 14:1996;426.
19. Trenkler T., De Wolf P., Vandervorst W. J. Vac. Sci. Technol. B. 16:1998;367.
20. De Wolf P., Clarysse T., Vandervorst W. J. Vac. Sci. Technol. B. 14:1996;380.
21. Müller F., Müller A.D., Hietschold M. Microelectron. Reliab. 37:1997;1631.
22. Duparré A., Ruppe C., Barna P.B., Adamik M., Pischow K.A. Thin Solid Films. 261:1995;70.
23. Pischow K.A., Adamik M., Barna P.B., Korhonen A.S. J. Vac. Sci. Technol. B 12:1994;1716.
24. LaGraff J.R., Murduck J.M. J. Mater. Res. 12:1997;1935.
25. George M.A., Burger A., Collins W.E., Davidson J.L., Barnes A.V., Tolk N.H. J. Appl. Phys. 76:1994;4099.
26. Zweibel K. Sol. Energy Mater. Sol. Cells. 59:1999;1.
27. Moutinho H.R., Dhere R.G., Al-Jassim M.M., Levi D.H., Kazmerski L.L. J. Vac. Sci. Technol. B. 17:1999;1793.
28. Rose D.H., Hasoon F.S., Dhere R.G., Albin D.S., Ribelin R.M., Li X.S., Mahathongdy Y., Gessert T.A., Sheldon P. Progr. Photovolt. 7:1999;331.
29. Ramanathan K., Wiesner H., Asher S., Bhattacharya R.N., Keane J., Contreras M.A., Noufi R. AIP Conf. Proc. 462:1999;9.
30. Phillips R.W. Surf. Coat. Technol. 68/69:1994;770.
31. Bierwagen G.P., Twite R., Chen G., Tallman D.E. Progr. Org. Coat. 32:1997;25.
32. Tojima T., Hatakeyama D., Yamane Y., Kawabata K., Ushiki T., Ogura S., Abe K., Ito E. Jpn. J. Appl. Phys. 37:1998;3855.
33. Goldstein J.I., Newbury D.E., Echlin P., Joy D.C. Scanning Electron Microscopy and X-ray Microanalysis. 1992;226 Plenum Press, New York.