Creep Analysis of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag and 100ln Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AG, Issue , 2000, Pages 79-89

  Lau, John H ^a   Pan, Stephen H ^a   Chang, Chris ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FLIP CHIP DEVICES; LEAD ALLOYS; PRINTED CIRCUIT BOARDS; SHEAR STRESS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; TIMING CIRCUITS; TIN ALLOYS;

CREEP ANALYSIS; CREEP STRAIN; CYCLING CONDITIONS; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDER JOINT; MICROVIAS; PRINTED CIRCUIT BOARDS ASSEMBLIES; SOLDER ALLOYS; THERMAL-CYCLING; WAFER-LEVEL CHIP SCALE PACKAGES;

LEAD-FREE SOLDERS;

EID: 85120427522     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-2258     Document Type: Conference Paper

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