Development of repairable Au-Al solid phase diffusion flip-chip bonding

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 101-107

  Iida, Atsuko ^a   Kizaki, Yukio ^a   Fukuda, Yumi ^a   Mori, Miki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; DIFFUSION IN SOLIDS; ELECTRIC CONNECTORS; ELECTRIC RESISTANCE MEASUREMENT; FLIP CHIP DEVICES; GOLD; HIGH TEMPERATURE TESTING; INTERMETALLICS; LIQUID CRYSTAL DISPLAYS; LSI CIRCUITS; SUBSTRATES;

CHIP ON GLASS (COG) BONDING TECHNIQUE; THERMAL SHOCK TEST;

GLASS BONDING;

EID: 0030647007     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)