Understanding the process window for printing lead-free solder pastes

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1426-1435

  Nguty, Tennyson A ^a   Salam, Budiman ^a   Rajkumar, Durairaj ^a   Ekere, Ndy N ^a  

^a UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS INDUSTRY; FAILURE ANALYSIS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT TESTING; QUALITY CONTROL; SOLDERING;

LEAD FREE SOLDERS; SOLDER PASTE PRINTING; SOLDER PASTES; SURFACE MOUNT ASSEMBLIES;

SURFACE MOUNT TECHNOLOGY;

EID: 0034476325     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)