Flip chip processing of lead-free solders and halogen-free high density microvia substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1101-1105

  Baynham, Grant ^a   Baldwin, Daniel F ^a   Boustedt, Katarina ^b   Johansson, Anette ^b   Wennerholm, Claes ^b   Patterson, Deborah ^c   Elenius, Peter ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b ERICSSON RESEARCH   (Sweden)

^c Electronic Visions Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL IMPACT; RELIABILITY; SOLDERING ALLOYS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; SURFACE PROPERTIES; THERMAL CYCLING;

HIGH DENSITY MICROVIA SUBSTRATES; LEAD FREE SOLDER; THERMAL CYCLE TESTING;

FLIP CHIP DEVICES;

EID: 0034476686     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)