Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1172-1183

  Vianco, Paul ^a   Rejent, Jerry ^a   Artaki, Iris ^a   Ray, Urmi ^a   Finley, Donald ^a   Jackson, Anna ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL IMPURITIES; ELECTRONICS PACKAGING; LEAD; METALLURGY; PERFORMANCE; PHASE TRANSITIONS; SHEAR STRENGTH; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; THERMOANALYSIS; TIN ALLOYS;

ELECTRONIC ASSEMBLY; GULL WING JOINT STRENGTHS; IN PLUG SHEAR STRENGTH; LEAD CONTAINING SURFACE FINISH; LEAD FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0029723946     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)