Lead-free and no-clean soldering for automotive electronics

Soldering and Surface Mount Technology

Volumn 9, Issue 2, 1997, Pages 5-8

  Shangguan, D ^a   Gao, G ^a  

^a FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILES; COSTS; ELECTRONIC EQUIPMENT; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; MANUFACTURE; MECHANICAL PROPERTIES; PHYSICAL PROPERTIES; RELIABILITY; SOLDERING ALLOYS; TECHNOLOGY; TOXICITY;

AUTOMOTIVE ELECTRONICS; ELECTROCHEMICAL PROPERTIES; LEAD FREE SOLDERING; MELTING POINT; NO CLEAN SOLDERING;

SOLDERING;

EID: 0031192232     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919710800665     Document Type: Article

References (22)

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