Lead free solder paste flux evaluation and implementation in personal communication devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1420-1425

  Butterfield, Andrew ^a   Visintainer, Valerie ^a   Goudarzi, Vahid ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; CONSUMER ELECTRONICS; COPPER ALLOYS; LEAD; NICKEL ALLOYS; PERSONAL COMMUNICATION SYSTEMS; PRINTED CIRCUIT BOARDS; PRINTING; RESISTORS; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

LEAD FREE SOLDER PASTE FLUX; ORGANIC SURFACE PROTECTION; SURFACE INSULATION RESISTANCE;

SOLDERING;

EID: 0034476753     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)