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Volumn , Issue , 2000, Pages 1410-1415
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Lead-free solder implementation for automotive electronics
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Author keywords
[No Author keywords available]
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Indexed keywords
AUTOMOTIVE INDUSTRY;
CHIP SCALE PACKAGES;
ELECTROMIGRATION;
ELECTRONICS PACKAGING;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT TESTING;
LEAD;
PRINTED CIRCUIT BOARDS;
SOLDERING ALLOYS;
SURFACE MOUNT TECHNOLOGY;
THERMAL CYCLING;
TIN ALLOYS;
AUTOMOTIVE ELECTRONICS;
LEAD FREE SOLDERING;
PARAMETER WEIBULL FUNCTION;
RELIABILITY TESTING;
SOLDERING;
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EID: 0034476692
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (20)
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References (8)
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