A thermal fatigue failure mechanism of 58BI-42SN solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 2, 1996, Pages 62-66

  Mei, Zequn ^a   Holde, Helen ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH ALLOYS; COATINGS; EUTECTICS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; GRAIN GROWTH; LEAD ALLOYS; PRINTED CIRCUIT BOARDS; STRENGTH OF MATERIALS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; TIN ALLOYS;

HOT AIR LEVELED BOARDS; PHASE AGGLOMERATION;

SOLDERED JOINTS;

EID: 0030169972     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792133     Document Type: Article

References (1)

1. Humpston, Giles, and Jacobson, David M., Principles of Soldering and Brazing, ASM International, 1993, p. 63.