Eutectic Sn-Ag solder bump process for ULSI flip chip technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1095-1100

  Ezawa, Hirokazu ^a   Miyata, Masahiro ^a   Honma, Soichi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; MASKS; NICKEL; PALLADIUM; SILVER; THIN FILM DEVICES; TIN; TITANIUM; ULSI CIRCUITS;

SOLDER BUMP PROCESS; THICK RESISTS PLATING MASK;

FLIP CHIP DEVICES;

EID: 0034479501     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)