Eutectic Sn-Bi as an alternative to Pb-free solders

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 277-283

  Hua, F ^a   Mei, Zequn ^a   Glazer, J ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; BISMUTH ALLOYS; EUTECTICS; ISOTHERMS; LEAD-FREE SOLDERS; MECHANICAL PROPERTIES; NETWORK COMPONENTS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; WETTING; CREEP; DISSOLUTION; FATIGUE OF MATERIALS; HIGH TEMPERATURE EFFECTS; SHEAR STRENGTH; SOLDERED JOINTS; TIN COMPOUNDS;

ELECTRONIC ASSEMBLIES; ELECTRONIC INDUSTRIES; EUTECTIC BI-SN SOLDER; ISOTHERMAL FATIGUE; LOW-TEMPERATURE FLUX; NO-CLEAN FLUXES; STEADY STATE CREEP RATE; WETTING BALANCE;

TIN ALLOYS; SURFACE MOUNT TECHNOLOGY;

FATIGUE RESISTANCE; ISOTHERMAL RESISTANCE;

EID: 0031631752     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678706     Document Type: Conference Paper

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