Thermal mechanical property testing of new lead-free solder joints

Soldering and Surface Mount Technology

Volumn 9, Issue 3, 1997, Pages 37-40

  Ren, Wei ^a   Lu, Minfu ^a   Liu, Sheng ^a   Shangguan, Dongkai ^b  

^a Wayne State University   (United States)

^b FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; LEAD ALLOYS; SHEAR STRENGTH; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

EUTECTIC SOLDERS; LEAD-FREE SOLDERS;

SOLDERED JOINTS;

EID: 0031245811     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

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2. Ewell, G.J. and Robertson, S.R., "Development of Pb-free solder: an overview", The Second International Symposium on Electronic Packaging Technology, 9-12 December, Shanghai, China, 1996, pp. 73-8.
3. Kang, S.K., "Lead (Pb)-free solders for electronic packaging", Journal of Electronic Material, Vol. 23 No. 8, 1994, pp. 701-7.
4. Shangguan, D., Achari, A. and Green, W., "Application of lead-free eutectic-Sn-Ag solder in no-clean thick film electronic modules", Components, Packaging and Manufacturing Technology - Part B. Vol. 17 No. 4, 1994, pp. 603-11.
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8. Lloyd, J.R., Zhang, C., Tan, H.L., Shangguan, D. and Achari, A., "Measurement of thermal conductivity and specific heat of lead free solder". Proceedings of the 1995 IEEE/CPMT International Electronic Manufacturing Technology Symposium, Austin, TX, October 1995, pp. 252-62.
9. Chada, S., Hermann, A., Laub, W., Fournelle, R., Shangguan, D. and Achari, A., "Microntructural investigation of Sn-Ag and Sn-Pb-Ag solder joints", Proceedings of NEPCON West '96, Anaheim, CA, February 1996, pp. 195-205.
10. Cosmie, M., Sullivan, J. and Shangguan, D., "LCA for automotive electronic systems: substitution assesment of Ag-Sn solder at Ford Motor Company", Proceedings of the International Sympsoium on Electronics and the Environment, Dallas, TX, May 1996, pp. 58-63.
11. Zhang, Z., Yao, D. and Shang, J.K., "Fatigue crack initiation in solder joints", Journal of Electronic Packaging, Vol. 118, 1996, pp. 41-4.
12. Lu, M., Ren, W., and Liu, S., "A unique multi-axil thermomechanical fatigue tester for electronic packaging materials", The Second Internationsl Symposium on Electronic Packaging Technology, 9-12 December, Shanghui, China, 1996.
13. Shanggun, D. and Achari, A., United Statics Patent. Patent Number. 5.429.689.4 July 1995.