Fundamentals of Electromigration

Springer Series in Materials Science

Volumn 117, Issue , 2007, Pages 211-243

  Tu, King Ning ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Back Stress; Critical Length; Solder Bump; Solder Joint; Void Formation

Indexed keywords

EID: 85072869527     PISSN: 0933033X     EISSN: 21962812     Source Type: Book Series    
DOI: 10.1007/978-0-387-38892-2_8     Document Type: Chapter

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