Effect of Cu3 Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects

Applied Physics Letters

Volumn 87, Issue 21, 2005, Pages 1-3

  Yan, M Y ^a   Suh, J O ^a   Ren, F ^a   Tu, K N ^a   Vairagar, A V ^b   Mhaisalkar, S G ^b   Krishnamoorthy, Ahila ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BINDING; INTERCONNECT LINE; SURFACE DIFFUSION PATHS; VOID FORMATION;

COATINGS; DIFFUSION; DISSOCIATION; ELECTROMIGRATION; GRAIN BOUNDARIES; MATHEMATICAL MODELS; OPTICAL INTERCONNECTS; TIN;

COPPER;

EID: 27844516469     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2132536     Document Type: Article

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