Low-Temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2017, Pages 976-981

  Li, Junjie ^a   Shi, Tielin ^a   Yu, Xing ^a   Cheng, Chaoliang ^a   Fan, Jinhu ^a   Liao, Guanglan ^a   Tang, Zirong ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

3D IC; Cu nanoparticles; Cu Cu bonding; Nanosolder paste; Sintering

Indexed keywords

BINARY ALLOYS; COPPER; NANOPARTICLES; NETWORK COMPONENTS; SYNTHESIS (CHEMICAL); TEMPERATURE; THREE DIMENSIONAL INTEGRATED CIRCUITS; WAFER BONDING;

BONDING PERFORMANCE; COMPACT MICROSTRUCTURE; CU NANO-PARTICLES; CU-CU BONDINGS; NANOSOLDER; SINTERING PROPERTIES; SINTERING TEMPERATURES; WAFER LEVEL PACKAGING;

SINTERING;

EID: 85028086241     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2017.35     Document Type: Conference Paper

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