Submicron Cu/Sn bonding technology with transient Ni diffusion buffer layer for 3DIC application

IEEE Electron Device Letters

Volumn 35, Issue 11, 2014, Pages 1118-1120

  Chang, Yao Jen ^a   Hsieh, Yu Sheng ^a   Chen, Kuan Neng ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

3D integration; Cu Sn bonding; transient Ni buffer layer

Indexed keywords

3-D INTEGRATION; BONDING TECHNOLOGY; NI DIFFUSION; SUBMICRON;

EID: 84908362112     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2014.2358212     Document Type: Article

References (17)

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