SCOPUS 정보 검색 플랫폼

Journal of Alloys and Compounds

Volumn 586, Issue , 2014, Pages 633-638

Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing

(3) Yu, Chi Yang a Chen, Wei Yu a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Intermetallics; Mechanical properties; Metals and alloys; Microstructure; Surfaces and interfaces

Indexed keywords

FRACTURE TOUGHNESS; INTERMETALLICS; LEAD-FREE SOLDERS; MECHANICAL PROPERTIES; METALLURGY; MICROSTRUCTURE; SILVER ALLOYS; SOLDERED JOINTS; THERMAL AGING; TIN ALLOYS; ZINC ALLOYS;

BONDING ENERGIES; HIGH SPEED SHEARS; JOINT INTERFACES; METALS AND ALLOYS; PB-FREE SOLDER JOINTS; SN-3.0AG-0.5CU; SURFACES AND INTERFACES; UNDER BUMP METALLIZATION;

COPPER ALLOYS;

EID: 84887275092 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2013.10.113 Document Type: Article

Times cited : (38)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.