Surface effect induced Cu-Cu bonding by Cu nanosolder paste

Materials Letters

Volumn 184, Issue , 2016, Pages 193-196

  Li, J J ^a   Cheng, C L ^a   Shi, T L ^a,b   Fan, J H ^a   Yu, X ^a   Cheng, S Y ^a   Liao, G L ^a,b   Tang, Z R ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Cu Cu bonding; Nanoparticles; Nanosolder paste; Sintering; Surface effect

Indexed keywords

ARGON; NANOPARTICLES; SINTERING; THREE DIMENSIONAL INTEGRATED CIRCUITS;

BONDING PROCESS; CU NANO-PARTICLES; CU-CU BONDINGS; EXPERIMENTAL ENVIRONMENT; HIGH-DENSITY PACKAGING; NANOSOLDER; SURFACE EFFECT; THERMO-COMPRESSION;

SYNTHESIS (CHEMICAL);

EID: 84983315042     PISSN: 0167577X     EISSN: 18734979     Source Type: Journal    
DOI: 10.1016/j.matlet.2016.08.085     Document Type: Article

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