Enhancement of the impact toughness in Sn-Ag-Cu/Cu solder joints via modifying the microstructure of solder alloy

Materials Letters

Volumn 119, Issue , 2014, Pages 20-23

  Yu, Chi Yang ^a   Lee, Joseph ^a   Chen, Wen Lin ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electronic materials; Impact reliability; Metallurgy; Microstructure; Solder

Indexed keywords

ELECTRONIC MATERIALS; HIGH SPEED SHEARS; NETWORK TYPES; PHASE PRECIPITATIONS; REFLOW PROCESS; SN-3.0AG-0.5CU; SOLDER ALLOYS; SOLDER JOINTS;

ANNEALING; FRACTURE TOUGHNESS; METALLURGY; MICROSTRUCTURAL EVOLUTION; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING; SOLIDIFICATION; TIN ALLOYS;

TIN;

EID: 84892620450     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2013.12.088     Document Type: Article

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