Low-temperature sintering bonding using silver nanoparticle paste for electronics packaging

Journal of Nanomaterials

Volumn 2015, Issue , 2015, Pages

  Guo, Wei ^a   Zeng, Zhi ^b   Zhang, Xiaoying ^a   Peng, Peng ^c   Tang, Shanping ^a  

^a BEIHANG UNIVERSITY   (China)

^b UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA   (China)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; METAL NANOPARTICLES; NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SINTERING; TEMPERATURE; THERMOGRAVIMETRIC ANALYSIS;

CHEMICAL REDUCTION; FRACTURE MORPHOLOGY; JOINT SHEAR STRENGTHS; LOW-TEMPERATURE SINTERING; METALLURGICAL BONDS; SILVER NANOPARTICLE PASTES; SINTERING TEMPERATURES; THERMAL CHARACTERISTICS;

SILVER;

EID: 84940416913     PISSN: 16874110     EISSN: 16874129     Source Type: Journal    
DOI: 10.1155/2015/897142     Document Type: Article

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