-
2
-
-
84892825506
-
-
Nov. 1
-
R.D. Hilty, ECN, Nov. 1, 2005. http://www.ecnmag.com/article/CA6279217. html.
-
(2005)
ECN
-
-
Hilty, R.D.1
-
3
-
-
33845687559
-
-
Dec. 22
-
J.F. Mason, Electronic News, Dec. 22, 2005. http://www.readelectronics. com/electronicnews/index.asp?layout=articleprint&articleID.
-
(2005)
Electronic News
-
-
Mason, J.F.1
-
4
-
-
33845692885
-
-
Dec. 23
-
S. Deffree, Electronic News, Dec. 23, 2005. http://www.readelectronics. com/electronicnews/index.asp?layout=articlePrint&articleID.
-
(2005)
Electronic News
-
-
Deffree, S.1
-
7
-
-
84892784882
-
-
Implementation of Lead-free Packages, Spansion, 2005, http://www.spansion.com/support/lead-free-flash/Lead-Free- Packages.html.
-
(2005)
Implementation of Lead-free Packages
-
-
-
8
-
-
84870447881
-
-
Backward and Forward Compatibility, Dallas Semiconductor, http://www.maxim-ic.com/emmi/backward-forwards-compatibility.cfm.
-
Dallas Semiconductor
-
-
-
9
-
-
33845705032
-
-
Nov
-
R. Rowland, Surface Mount Technology, Nov. 2005, http://www.surfacemount. printthis.clickability.com/pt/cpt?action=cpt&title=surface+Mount+TEC.
-
(2005)
Surface Mount Technology
-
-
Rowland, R.1
-
11
-
-
84892821886
-
-
Lead Free and ROHS Data, Freescale Semiconductor, 2004/2005, http://www.freescale.com/wehap/sps/site/overview.jsp?nodeId=061R7NMSSR.
-
(2004)
Lead Free and ROHS Data
-
-
-
12
-
-
84892830912
-
-
Sept. 22
-
F. Hua, R. Aspandiar, T. Rothman, C. Anderson, G. Clemons, M. KLIER, in Proc. Surface Mount Technol. Assoc. (SMTA) International Conf., Sept. 22 (2002).
-
(2002)
Proc. Surface Mount Technol. Assoc. (SMTA) International Conf
-
-
Hua, F.1
Aspandiar, R.2
Rothman, T.3
Anderson, C.4
Clemons, G.5
Klier, M.6
-
13
-
-
33845698415
-
-
Sept 21
-
F. Hua, R. Aspandiar, C. Anderson, G. Clemons, C. Chung, M. Faizul, in Proc. Surface Mount Technology Assoc. (SMTA) International Conf., Sept 21, (2003) pp. 246-252.
-
(2003)
Proc. Surface Mount Technology Assoc. (SMTA) International Conf.
, pp. 246-252
-
-
Hua, F.1
Aspandiar, R.2
Anderson, C.3
Clemons, G.4
Chung, C.5
Faizul, M.6
-
14
-
-
84892824930
-
-
May, Toronto, Canada
-
S. Bagheri, P. Snugovsky, Z. Bagheri, M. Romansky, M. Kelly, M. Cole, M. Interrante, G. Martin, C. Bergeron, in Proc. CMAP International Conf. on Lead-free Soldering, (May, 2006) Toronto, Canada.
-
(2006)
Proc. CMAP International Conf. on Lead-free Soldering
-
-
Bagheri, S.1
Snugovsky, P.2
Bagheri, Z.3
Romansky, M.4
Kelly, M.5
Cole, M.6
Interrante, M.7
Martin, G.8
Bergeron, C.9
-
15
-
-
84892800172
-
-
May, Toronto, Canada
-
P. Snugovsky, M. Kelly, A. Zberzhy, M. Romansky, in Proc. CMAP International Conf. on Lead-free Soldering, May, 2005, Toronto, Canada.
-
(2005)
Proc. CMAP International Conf. on Lead-free Soldering
-
-
Snugovsky, P.1
Kelly, M.2
Zberzhy, A.3
Romansky, M.4
-
17
-
-
25844440775
-
-
eds. by K.J. Puttlitz,(Marcel Dekker, Inc, New York)
-
K.J. Puttlitz, in Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, eds. by K.J. Puttlitz, K.A. Stalter (Marcel Dekker, Inc, New York, 2004) pp. 239-280.
-
(2004)
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
, pp. 239-280
-
-
Puttlitz, K.J.1
Stalter, K.A.2
-
21
-
-
84892826897
-
-
SAND 95-0196. UL-704, Sandia National Laboratories, Feb
-
C.A. Drewin, F.G. Yost, S.J. Sackinger, J. Kern et al. Sandia report, SAND 95-0196. UL-704, Sandia National Laboratories, Feb. 1995.
-
(1995)
Sandia Report
-
-
Drewin, C.A.1
Yost, F.G.2
Sackinger, S.J.3
Kern, J.4
-
23
-
-
84892802463
-
-
Parsippany, NJ, June
-
J.M. Tsung-Yu Pan, H.D. Nicholson, R.H. Blair et al., in Proc. 7th International SAMPLE Electronics Conf. (Parsippany, NJ, June 1994) pp. 343-354.
-
(1994)
th International SAMPLE Electronics Conf
, pp. 343-354
-
-
Tsung-Yu Pan, J.M.1
Nicholson, H.D.2
Blair, R.H.3
-
24
-
-
3242805755
-
-
(Marcel Dekker, Inc. New York)
-
T.J. Singler, S.J. Meschter, J. Spalik, in Handbook of Leadfree Solder Technology for Microelectronic Assemblies, eds. by K.J. Puttlitz, K.A. Stalter (Marcel Dekker, Inc., New York, 2004) pp. 331-429.
-
(2004)
Handbook of Leadfree Solder Technology for Microelectronic Assemblies
, pp. 331-429
-
-
Singler, T.J.1
Meschter, S.J.2
Spalik, J.3
Puttlitz, K.J.4
Stalter, K.A.5
-
25
-
-
0034297162
-
-
K.W. Moon, W.J. Boettinger, U.R. Kitten, F.S. Biancaniello and C.A. Handwerker, J. Electron. Mater. 29(10) 1122 (2000).
-
(2000)
J. Electron. Mater.
, vol.29
, Issue.10
, pp. 1122
-
-
Moon, K.W.1
Boettinger, W.J.2
Kitten, U.R.3
Biancaniello, F.S.4
Handwerker, C.A.5
-
26
-
-
0033743782
-
-
April
-
M.E. Loomans, M.E. Fine, Metall. Mater. Trans. A, Phys. Metall. Mater. Sci., 31A(4) 1155 (April 2000).
-
(2000)
Metall. Mater. Trans. A, Phys. Metall. Mater. Sci
, vol.31 A
, Issue.4
, pp. 1155
-
-
Loomans, M.E.1
Fine, M.E.2
-
27
-
-
3142701482
-
-
D.W. Henderson, J.J. Woods, T.A. Gosselin, J. Bartelo et al., J. Mat. Res. 19(6) 1608 (2004).
-
(2004)
J. Mat. Res
, vol.19
, Issue.6
, pp. 1608
-
-
Henderson, D.W.1
Woods, J.J.2
Gosselin, T.A.3
Bartelo, J.4
-
28
-
-
0036864534
-
-
D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.K. Choi, D.Y. ShIH, C. Goldsmith, K. Puttlitz, J. Mater. Res. 17(11) 2775 (2002).
-
(2002)
J. Mater. Res
, vol.17
, Issue.11
, pp. 2775
-
-
Henderson, D.W.1
Gosselin, T.2
Sarkhel, A.3
Kang, S.K.4
Choi, W.K.5
Shih, D.Y.6
Goldsmith, C.7
Puttlitz, K.8
-
30
-
-
0035359656
-
-
D.R. Frear, J.W. Jang, J.K. Lin, C. Zhang, J. Minerals, Metals, Mat. Sci. (JOM) 53(6) 28 (2001).
-
(2001)
J. Minerals, Metals, Mat. Sci. (JOM)
, vol.53
, Issue.6
, pp. 28
-
-
Frear, D.R.1
Jang, J.W.2
Lin, J.K.3
Zhang, C.4
-
31
-
-
0038351737
-
-
New Orleans, LA, May
-
S.K. Kang, W.K. Choi, D.Y. Shih, D.W. Henderson, T. Gosselin, A. Sarknel, C. Goldsmith and K.J. Puttlitz, in Proc. of 53rd Electronic Components and Technology Conference (New Orleans, LA, May 2003) pp. 64-70.
-
(2003)
Proc. of 53rd Electronic Components and Technology Conference
, pp. 64-70
-
-
Kang, S.K.1
Choi, W.K.2
Shih, D.Y.3
Henderson, D.W.4
Gosselin, T.5
Sarknel, A.6
Goldsmith, C.7
Puttlitz, K.J.8
-
32
-
-
25844438737
-
-
S.K. Kang, P.A. Lauro, D.Y. Shih, D.W. Henderson, K.J. Puttlitz, IBM J. Res. Dev. 415, 607 (2005).
-
(2005)
IBM J. Res. Dev
, vol.415
, pp. 607
-
-
Kang, S.K.1
Lauro, P.A.2
Shih, D.Y.3
Henderson, D.W.4
Puttlitz, K.J.5
-
33
-
-
33845686653
-
-
Berlin, Germany (Sept)
-
A. Woosley, G. Swan, T.S. Chong, L. Matsushita, T. Koschimieder, K. Simmons, in Proc. Electronics Goes Green: Fraunhoffer Institute, Berlin, Germany (Sept. 2000).
-
(2000)
Proc. Electronics Goes Green: Fraunhoffer Institute
-
-
Woosley, A.1
Swan, G.2
Chong, T.S.3
Matsushita, L.4
Koschimieder, T.5
Simmons, K.6
-
34
-
-
0003589047
-
-
Chicago, IL, Sept
-
S. Prasad, F. Carson, G.S. Kim, L.S. Lee, A. Garcia, P. Rouband, G. Henshall, S. Kamath, R. Herber, R. Bulwith, in Proc. SMTA Internat. Conf. (Chicago, IL, Sept. 2000) pp. 272-276.
-
(2000)
Proc. SMTA Internat. Conf
, pp. 272-276
-
-
Prasad, S.1
Carson, F.2
Kim, G.S.3
Lee, L.S.4
Garcia, A.5
Rouband, P.6
Henshall, G.7
Kamath, S.8
Herber, R.9
Bulwith, R.10
-
35
-
-
84892829103
-
-
San Diego, CA, Jan, LF2-2
-
J. Bartelo, S. Cain, D. Caletka, K. Darbha, T. Gosselin, D.W. Henderson, D. King, K. Knadle, A. Sharkel, G. Thiel, C. WoychiK, D.Y. Shih, S.K. Kang, K.J. Puttlitz, J. Woods, in Proc. of APEX 2001 (San Diego, CA, Jan, 2001) 14-18, LF2-2, 1-12.
-
(2001)
Proc. of APEX 2001
, vol.14-18
, pp. 1-12
-
-
Bartelo, J.1
Cain, S.2
Caletka, D.3
Darbha, K.4
Gosselin, T.5
Henderson, D.W.6
King, D.7
Knadle, K.8
Sharkel, A.9
Thiel, G.10
Woychik, C.11
Shih, D.Y.12
Kang, S.K.13
Puttlitz, K.J.14
Woods, J.15
-
36
-
-
2442575860
-
-
S.K. Kang, P. Lauro, D.Y. Shih, D.W. Henderson, J. Bartelo, T. Gosselin, S.R. Cain, C. Goldsmith, K.J. Puttlitz, T.K. Hwang, W.K. Choi, Mater. Trans. (Jpn. Inst. Metals) 45(3) 695 (2004).
-
(2004)
Mater. Trans. (Jpn. Inst. Metals)
, vol.45
, Issue.3
, pp. 695
-
-
Kang, S.K.1
Lauro, P.2
Shih, D.Y.3
Henderson, D.W.4
Bartelo, J.5
Gosselin, T.6
Cain, S.R.7
Goldsmith, C.8
Puttlitz, K.J.9
Hwang, T.K.10
Choi, W.K.11
-
37
-
-
0038351738
-
-
New Orleans, LA, May
-
J.W. Morris, H.G. Song, F. Hua, in Proc. 53rd Electronic Components Technology Conf., (New Orleans, LA, May 2003) pp. 54-57.
-
(2003)
rd Electronic Components Technology Conf
, pp. 54-57
-
-
Morris, J.W.1
Song, H.G.2
Hua, F.3
-
38
-
-
3242805755
-
-
(Marcel Dekker, Inc. New York)
-
M.J. Sullivan, S.J. Kilpatrick, in Handbook of Lead-free Solder Technology for Microelectronic Assemblies, eds. by K.J. Puttlitz, K.A. Stalter (Marcel Dekker, Inc., New York, 2004) pp. 915-978.
-
(2004)
Handbook of Lead-free Solder Technology for Microelectronic Assemblies
, pp. 915-978
-
-
Sullivan, M.J.1
Kilpatrick, S.J.2
Puttlitz, K.J.3
Stalter, K.A.4
-
39
-
-
32844473264
-
-
W.J. Choi, G. Galyon, K.N. Tu, T.Y. Lee, in Handbook of Lead-free Solder Technology for Microelectronic Assemblies, eds. by K.J. Puttlitz, K.A. Stalter (Marcel Dekker, Inc., New York, 2004), 851-913.
-
Handbook of Lead-free Solder Technology for Microelectronic Assemblies
, pp. 851-913
-
-
Choi, W.J.1
Galyon, G.2
Tu, K.N.3
Lee, T.Y.4
-
47
-
-
26844565117
-
-
W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.W. Moon, M.E. Williams, G.R. Stafford, Acta Mater. 11, 5033 (2005).
-
(2005)
Acta Mater
, vol.11
, pp. 5033
-
-
Boettinger, W.J.1
Johnson, C.E.2
Bendersky, L.A.3
Moon, K.W.4
Williams, M.E.5
Stafford, G.R.6
-
48
-
-
33845690380
-
-
N. Vo, M. Kwoka, P. Bush, IEEE Trans. Electr. Pkg. Mfg., 1, 7 (2005).
-
(2005)
IEEE Trans. Electr. Pkg. Mfg
, vol.1
, pp. 7
-
-
Vo, N.1
Kwoka, M.2
Bush, P.3
-
50
-
-
24644494403
-
-
Lake Buena Vista, FL, May 31-June 3
-
P. Su, M. Ding, T. Uehling, D. Wonton, P.S. HO, in Proc. 55th Electronic Components & Technology Conf., (Lake Buena Vista, FL, May 31-June 3, 2005) pp. 1431-1436.
-
(2005)
th Electronic Components & Technology Conf.
, pp. 1431-1436
-
-
Su, P.1
Ding, M.2
Uehling, T.3
Wonton, D.4
Ho, P.S.5
-
51
-
-
3242805755
-
-
(Marcel Dekker Inc. New York)
-
J.R. Lloyd, K.N. Tu, J. Jaspal, in Handbook of Lead-free Solder Technology for Microelectronic Assemblies, eds. K.J. Puttlitz, K.A. Stalter (Marcel Dekker Inc., New York, 2004) pp. 827-850.
-
(2004)
Handbook of Lead-free Solder Technology for Microelectronic Assemblies
, pp. 827-850
-
-
Lloyd, J.R.1
Tu, K.N.2
Jaspal, J.3
Puttlitz, K.J.4
Stalter, K.A.5
-
54
-
-
0035868113
-
-
T.Y. Lee, K.N. Tu, S.M. Kuo, D.R. Frear, J. Appl. Phys. 89, 3189 (2000).
-
(2000)
J. Appl. Phys
, vol.89
, pp. 3189
-
-
Lee, T.Y.1
Tu, K.N.2
Kuo, S.M.3
Frear, D.R.4
-
56
-
-
33845712298
-
-
San Diego, CA
-
S.Y. Yang, J. Wolf, W.S. Kwon, K.W. Park, in Proc. 52nd Electronic Components and Technology. Conf. (San Diego, CA, 2002) pp. 1213-1230.
-
(2002)
nd Electronic Components and Technology. Conf.
, pp. 1213-1230
-
-
Yang, S.Y.1
Wolf, J.2
Kwon, W.S.3
Park, K.W.4
-
59
-
-
0038310181
-
-
Dallas, TX
-
J.D. Wu, P.J. Zheng, C.W. Lee, S.C. Hung, J.J. Lee, in Proc. 41st IEEE Internat. Rel. Physics Symp. (Dallas, TX, 2003) p. 132.
-
(2003)
st IEEE Internat. Rel. Physics Symp
, pp. 132
-
-
Wu, J.D.1
Zheng, P.J.2
Lee, C.W.3
Hung, S.C.4
Lee, J.J.5
-
60
-
-
0242468675
-
-
Y.C. Hu et al., J. Mat. Res. 11 2544 (2003).
-
(2003)
J. Mat. Res
, vol.11
, pp. 2544
-
-
Hu, Y.C.1
|