Effect of deposition conditions and post deposition anneal on reactively sputtered titanium nitride thin films

Thin Solid Films

Volumn 578, Issue , 2015, Pages 31-37

  Ponon, Nikhil K ^a   Appleby, Daniel J R ^a   Arac, Erhan ^a   King, P J ^a   Ganti, Srinivas ^a   Kwa, Kelvin S K ^a   O'Neill, Anthony ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

Annealing; Reactive sputtering; Resistivity; Titanium nitride; X ray diffraction; X ray photoelectron spectroscopy

Indexed keywords

ANNEALING; ELECTRIC CONDUCTIVITY; FLOW RATE; NITROGEN; REACTIVE SPUTTERING; THIN FILMS; TITANIUM METALLOGRAPHY; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

DEPOSITION CONDITIONS; FILM ORIENTATIONS; NITROGEN FLOW RATES; POST DEPOSITION ANNEALING; POST-DEPOSITION ANNEAL; SILICON DIFFUSION; THERMAL AND ELECTRICAL STABILITY; TITANIUM NITRIDE THIN FILMS;

TITANIUM NITRIDE;

EID: 84925308560     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2015.02.009     Document Type: Article

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