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Journal of Alloys and Compounds

Volumn 629, Issue , 2015, Pages 16-21

Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications

(5) Yu, J J a Yang, C A a Lin, Y F a Hsueh, C H a Kao, C R a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Ag concentration; Intermetallic compound; Kirkendall effect; Micro joints; Space confinement

Indexed keywords

GROWTH KINETICS; INTERMETALLICS; NICKEL; SOLDERING ALLOYS; THREE DIMENSIONAL INTEGRATED CIRCUITS; TIN;

AG ADDITIONS; KIRKENDALL EFFECTS; MICRO VOIDS; MICRO-JOINT; OPTIMAL CONCENTRATION; OPTIMAL WEIGHT; SPACE CONFINEMENT;

SILVER;

EID: 84921272379 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2015.01.001 Document Type: Article

Times cited : (38)

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