Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip-chip solder bumps undergoing electromigration

Journal of Materials Research

Volumn 29, Issue 21, 2014, Pages 2556-2564

  Huang, Mingliang ^a   Zhang, Zhijie ^a   Zhou, Shaoming ^a   Chen, Leida ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

electromigration; failure mode; flip chip; Sn 3.0Ag 0.5Cu; solder bump; stress relaxation

Indexed keywords

CATHODES; COMPRESSIVE STRESS; COPPER ALLOYS; CREEP; ELECTROMIGRATION; FAILURE MODES; GRAIN BOUNDARY SLIDING; LEAD-FREE SOLDERS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; STRESS RELAXATION; TENSILE STRENGTH; TERNARY ALLOYS; TIN; TIN ALLOYS;

CURRENT CROWDING; FAILURE BEHAVIORS; FLIP CHIP; FLIP CHIP SOLDER BUMP; SN-3.0AG-0.5CU; SN-3.0AG-0.5CU SOLDERS; SOLDER BUMP; TERRACE MORPHOLOGY;

FLIP CHIP DEVICES;

EID: 84910153290     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2014.231     Document Type: Article

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