Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing

Acta Materialia

Volumn 59, Issue 6, 2011, Pages 2462-2468

  Ke, J H ^a   Yang, T L ^a   Lai, Y S ^b   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Diffusion; Intermetallic compounds; Interstitial; Kinetics; Soldering

Indexed keywords

CURRENT-STRESSING; DEGRADATION MECHANISM; DOMINANT MECHANISM; ELECTROMIGRATION FLUXES; ELECTRON CURRENTS; EXPERIMENTAL VERIFICATION; HIGHER TEMPERATURES; INTERMETALLIC COMPOUNDS; INTERSTITIAL; KEY FACTORS; METALLIZATION LAYERS; METALLIZATIONS; SOLDER JOINTS; VACANCY MECHANISMS; VOID FORMATION;

ACTIVATION ENERGY; DEGRADATION; DIFFUSION; ELECTROMIGRATION; INTERMETALLICS; METALLIZING; SOLDERING ALLOYS; TIN;

SOLDERING;

EID: 79951674215     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.12.048     Document Type: Article

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