Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array

Materials Letters

Volumn 78, Issue , 2012, Pages 72-74

  Geng, Wenyan ^a   Chen, Zhuo ^a   Hu, Anmin ^a   Li, Ming ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

3D package; Bonding strength; Diffusion; Interfaces; Low temperature insertion bonding; Plastic deformation

Indexed keywords

3-D PACKAGES; BOND INTERFACE; BONDING PROCESS; BONDING STRENGTH; BONDING TECHNOLOGY; DIFFUSION LAYERS; FAST DIFFUSION; INTERFACIAL MORPHOLOGIES; LOW TEMPERATURES; MECHANICAL INTERLOCKING; MICRO-NANO; VOID SHAPE;

DIFFUSION; DIFFUSION BONDING; INTERFACES (MATERIALS); PLASTIC DEFORMATION; THREE DIMENSIONAL;

TEMPERATURE;

EID: 84861596975     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2012.03.027     Document Type: Article

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