Nanoporous interconnects

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Oppermann, Hermann ^a   Dietrich, Lothar ^a   Klein, Matthias ^a   Wunderle, Bernhard ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING CONDITIONS; CELLULAR STRUCTURE; FLIP CHIP BONDING; LOW TEMPERATURES; MESOSCALE; NANO-POROUS; NANOPOROUS GOLD;

GOLD; GOLD ALLOYS; GOLD COATINGS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

SILVER ALLOYS;

EID: 78651319908     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5643002     Document Type: Conference Paper

References (4)

1. J. Zhu, E. Seker, H. Bart-Smith, M. R. Begley, R. Kelly, G. Zangari, W. Lye, M. L. Reed, "Mitigation of tensile failure in released nanoporous metal microstructures via thermal treatment," Applied Physics Letters, 89, 133104 (2006).
2. X. Lu, T.J. Balk, R. Spolenak, E. Arzt: "Dealloying of Au-Ag thin films with a composition gradient: Influence on morphology of nanoporous Au," Thin Solid Films 515 (2007) 7122-7126.
3. nd ed.
4. M. Abo Ras, M. Koch, J. Bauer, M. Klein, D. May, H. Oppermann, R. Schacht, B. Wunderle, B. Michel: Influences of Technological Processing and Surface Finishes on Thermal Behaviour of Thermal Interface Materials. THERMINIC 2010, 16th International Workshop on Thermal Investigations of ICs and Systems, Barcelona, Spain, 6-8 October 2010.