Low temperature bonding method using Cu micro cones

ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2012, Pages 224-226

  Lu, Qin ^a   Chen, Zhuo ^a   Hu, Anmin ^a   Li, Ming ^a   Mao, Dali ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING INTERFACES; FIELD EMISSION SCANNING ELECTRON MICROSCOPES; KEY SUCCESS FACTORS; LOW TEMPERATURE BONDING; MECHANICAL INTERLOCK; SN-3.0AG-0.5CU SOLDERS; SOLID STATE BONDING; SOLID-STATE DIFFUSION;

ELECTROLESS PLATING; ELECTRONICS PACKAGING; SOLDERING ALLOYS; TEMPERATURE; TIN;

BONDING;

EID: 84875424211     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT-HDP.2012.6474606     Document Type: Conference Paper

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