Low temperature wafer bonding by copper nanorod array

Electrochemical and Solid-State Letters

Volumn 12, Issue 4, 2009, Pages

  Wang, Pei I ^a   Lee, Sang Hwui ^a   Parker, Thomas C ^a   Frey, Michael D ^a   Karabacak, Tansel ^b   Lu, Jian Qiang ^a   Lu, Toh Ming ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b University of Arkansas at Little Rock ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COALESCENCE; COPPER; NANORODS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

ADHESIVE LAYERS; BONDING LAYERS; BONDING STRUCTURES; BONDING TEMPERATURES; COPPER NANORODS; ELECTRON MICROSCOPE IMAGES; HOMOGENEOUS STRUCTURES; LOW TEMPERATURES; LOW-TEMPERATURE WAFER BONDINGS; NANOROD ARRAYS; OBLIQUE-ANGLE DEPOSITIONS; POST-ANNEALING; SI WAFERS;

WAFER BONDING;

EID: 60449105985     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3075900     Document Type: Article

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