Low temperature thermocompression bonding based on copper nanostructure for 3D packaging

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 57-60

  Cai, Mingxian ^a   Chen, Mingxiang ^a,b   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

3D PACKAGING; BONDING INTERFACES; BONDING STRENGTH; CU LAYERS; CU-ZN ALLOY; DEALLOYING; LOW TEMPERATURES; SILICON SUBSTRATES; THERMO COMPRESSION BONDING; X RAY FLUORESCENCE ANALYSIS;

ELECTRONICS PACKAGING; HYDROCHLORIC ACID; NANOSTRUCTURES; PACKAGING; POROUS SILICON; SCANNING ELECTRON MICROSCOPY; TECHNOLOGY; THREE DIMENSIONAL;

COPPER ALLOYS;

EID: 81355153340     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6066789     Document Type: Conference Paper

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