Thermal-aware microchannel cooling of multicore processors: A three-stage design approach

Journal of Electronic Packaging

Volumn 136, Issue 2, 2014, Pages

  Li, Yubai ^a   Guo, Dongzhi ^a   Yao, Shi Chune ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; DROPS; INTEGRATED CIRCUIT DESIGN; MICROCHANNELS; PRESSURE DROP; PUMPS; THERMAL MANAGEMENT (ELECTRONICS); THERMOELECTRIC EQUIPMENT;

DESIGN APPROACHES; HIGH POWER; HOTSPOT TEMPERATURE; HOTTEST-SPOT TEMPERATURES; KEY DESIGN PARAMETERS; MICROCHANNEL COOLING; MULTI-CORE PROCESSOR; PUMPING POWER; STRAIGHT MICROCHANNELS; THERMAL-AWARE;

COOLING;

EID: 84899676891     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4027174     Document Type: Article

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