Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging

International Journal of Heat and Mass Transfer

Volumn 43, Issue 3, 2000, Pages 399-415

  Fedorov, Andrei G ^a   Viskanta, Raymond ^a  

^a Purdue University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COOLING; ELECTRONICS PACKAGING; FLOW PATTERNS; FRICTION; HEAT FLUX; HEAT SINKS; LAMINAR FLOW; MATHEMATICAL MODELS; NAVIER STOKES EQUATIONS; REYNOLDS NUMBER; TEMPERATURE DISTRIBUTION;

MICROCHANNEL HEAT SINKS;

HEAT TRANSFER;

FLOW PATTERN; HEAT EXCHANGER; HEAT TRANSFER; MICROELECTRONICS;

FLOW PATTERN; HEAT TRANSFER;

EID: 0342948889     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(99)00151-9     Document Type: Article

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