-
1
-
-
0004175432
-
-
Editor Clyde F. Coombs, 4th edition, McGraw-Hill, New York
-
th edition, McGraw-Hill, New York, 1995.
-
(1995)
Printed Circuits Handbook
-
-
-
2
-
-
33748210766
-
Pb-free high temperature solders for power device packaging
-
Y. Yamada, Y. Takaku, Y. Yagi, Y. Nishibe, I. Ohnuma, Y. Sutou, R. Kainuma and K. Ishida, "Pb-free high temperature solders for power device packaging," Microelectronics and Reliability, Vol. 46, pp. 1932-1937, 2006.
-
(2006)
Microelectronics and Reliability
, vol.46
, pp. 1932-1937
-
-
Yamada, Y.1
Takaku, Y.2
Yagi, Y.3
Nishibe, Y.4
Ohnuma, I.5
Sutou, Y.6
Kainuma, R.7
Ishida, K.8
-
3
-
-
0033876306
-
Packaging of integrated power electronics modules using flip-chip technology
-
New Orleans, LA
-
Xingsheng Liu, S. Haque, Jinggang Wang, and Guo-Quan Lu, "Packaging of integrated power electronics modules using flip-chip technology," IEEE Applied Power Electronics Conference and Exposition, Vol. 1, pp. 290-296, New Orleans, LA, 2000.
-
(2000)
IEEE Applied Power Electronics Conference and Exposition
, vol.1
, pp. 290-296
-
-
Xingsheng Liu, S.H.1
Wang, J.2
Lu, G.-Q.3
-
4
-
-
51349123581
-
-
http://emat.eng.hmc.edu/
-
-
-
-
5
-
-
0003689862
-
-
ASM International, Metal Park, Ohio
-
H. Okamoto and T. B. Massalski, Binary Alloy Phase Diagrams, pp. 381-383, ASM International, Metal Park, Ohio, 1990
-
(1990)
Binary Alloy Phase Diagrams
, pp. 381-383
-
-
Okamoto, H.1
Massalski, T.B.2
-
6
-
-
0029778009
-
On the mathematical description of the tensile stress-strain curves of polycrystalline face centered cubic metals
-
I. Kovács and G. Vörös, "On the mathematical description of the tensile stress-strain curves of polycrystalline face centered cubic metals," International Journal of Plasticity, Vol. 12, pp. 35-43, 1996.
-
(1996)
International Journal of Plasticity
, vol.12
, pp. 35-43
-
-
Kovács, I.1
Vörös, G.2
-
7
-
-
0003655607
-
-
Howard E. Boyer, editor, ASM International, Metal Park, Ohio
-
Howard E. Boyer, editor, Atlas of Stress-Strain Curves, ASM International, Metal Park, Ohio, 1987
-
(1987)
Atlas of Stress-Strain Curves
-
-
-
8
-
-
35348888344
-
Are intermetallics in solder joints really brittle?
-
Reno, Nevada, pp
-
Chin C. Lee, Pin J. Wang, and Jong S. Kim, "Are intermetallics in solder joints really brittle?" Proc. IEEE Electronic Components and Technology Conference, Reno, Nevada, pp.648-652, 2007.
-
(2007)
Proc. IEEE Electronic Components and Technology Conference
, pp. 648-652
-
-
Lee, C.C.1
Wang, P.J.2
Kim, J.S.3
-
9
-
-
34047106690
-
Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders
-
Jin-Wook Jang, Ananda P. De Silva, James E. Drye, Steve L. Post, Norman L. Owens, Jong-Kai Lin, and Darrel R. Frear, "Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, pp.49-53, 2007.
-
(2007)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.30
, pp. 49-53
-
-
Jang, J.-W.1
De Silva, A.P.2
Drye, J.E.3
Post, S.L.4
Owens, N.L.5
Lin, J.-K.6
Frear, D.R.7
-
10
-
-
24644455360
-
Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
-
Shengquan Qu, Yuhuan Xu, and K. N. Tu, "Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad," IEEE Electronic Components and Technology Conference, pp.467-471, 2005.
-
(2005)
IEEE Electronic Components and Technology Conference
, pp. 467-471
-
-
Qu, S.1
Xu, Y.2
Tu, K.N.3
-
11
-
-
33846097185
-
Design and construction of a compact vacuum furnace for scientific research
-
Dec
-
Chin C. Lee, Dave T. Wang, and Won S. Choi, "Design and construction of a compact vacuum furnace for scientific research," Review of Scientific Instruments, American Institute of Physics, Vol. 77, 125104, Dec. 2006.
-
(2006)
Review of Scientific Instruments, American Institute of Physics
, vol.77
, pp. 125104
-
-
Lee, C.C.1
Wang, D.T.2
Choi, W.S.3
-
12
-
-
0026116734
-
The kinetics of formation of intermetallics in Ag/In thin film couples
-
Rita Roy and S. K. Ken, "The kinetics of formation of intermetallics in Ag/In thin film couples," Thin Solid Films, Vol. 197, pp.303-318, 1991
-
(1991)
Thin Solid Films
, vol.197
, pp. 303-318
-
-
Roy, R.1
Ken, S.K.2
-
13
-
-
0018507042
-
-
V. Simic and Z. Marinkovic, Room temperature interactions in Ag-metals thin film couples, Thin Solid Films, 61, pp.149-W, 1979
-
V. Simic and Z. Marinkovic, "Room temperature interactions in Ag-metals thin film couples," Thin Solid Films, Vol.61, pp.149-W, 1979
-
-
-
-
14
-
-
0025403362
-
AES depth profile studies of interdiffusion in the Ag-Cu bilyaer and multilayer thin films
-
A. Bukaluk, "AES depth profile studies of interdiffusion in the Ag-Cu bilyaer and multilayer thin films," Physica Status Solidi. A, Applied Research, Vol. 118, pp.99-107, 1990.
-
(1990)
Physica Status Solidi. A, Applied Research
, vol.118
, pp. 99-107
-
-
Bukaluk, A.1
-
15
-
-
0011881587
-
Ion scattering spectroscopy and Auger electron spectroscopy depth profiles of silver-copper thin film interdiffusion
-
J. R. Pitts, A. W. Czanderna, and T. M. Thomas, "Ion scattering spectroscopy and Auger electron spectroscopy depth profiles of silver-copper thin film interdiffusion," J. Vac. Sci. Technol. A, Vol. 4, pp.1671-1674, 1986
-
(1986)
J. Vac. Sci. Technol. A
, vol.4
, pp. 1671-1674
-
-
Pitts, J.R.1
Czanderna, A.W.2
Thomas, T.M.3
-
16
-
-
0035873654
-
Auger electron spectroscopy investigations of the effect of degradation of depth resolution and its influence on the interdiffusion data in thin film Au/Ag, Cu/Ag, Pd/Au, Pd/Cu multilayer structures
-
A. Bukaluk, "Auger electron spectroscopy investigations of the effect of degradation of depth resolution and its influence on the interdiffusion data in thin film Au/Ag, Cu/Ag, Pd/Au, Pd/Cu multilayer structures," Applied Surface Science, Vol. 175, pp.790-796, 2001
-
(2001)
Applied Surface Science
, vol.175
, pp. 790-796
-
-
Bukaluk, A.1
-
17
-
-
34147143396
-
Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys
-
Jong S. Kim, Takehide Yokozuka, and Chin C. Lee, "Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys," Materials Science and Engineering A, Vol. 458, pp.116-122, 2007.
-
(2007)
Materials Science and Engineering A
, vol.458
, pp. 116-122
-
-
Kim, J.S.1
Yokozuka, T.2
Lee, C.C.3
|