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Volumn , Issue , 2008, Pages 1562-1568

A new bonding technology dealing with large CTE mismatch between large Si chips and Cu substrates

Author keywords

[No Author keywords available]

Indexed keywords

COPPER (CU); CU SUBSTRATES; ELECTRONIC COMPONENTS; SILICON (SI);

EID: 51349117385     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550184     Document Type: Conference Paper
Times cited : (9)

References (17)
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    • Kovács, I.1    Vörös, G.2
  • 7
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  • 10
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  • 12
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    • (1991) Thin Solid Films , vol.197 , pp. 303-318
    • Roy, R.1    Ken, S.K.2
  • 13
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    • V. Simic and Z. Marinkovic, Room temperature interactions in Ag-metals thin film couples, Thin Solid Films, 61, pp.149-W, 1979
    • V. Simic and Z. Marinkovic, "Room temperature interactions in Ag-metals thin film couples," Thin Solid Films, Vol.61, pp.149-W, 1979
  • 14
    • 0025403362 scopus 로고
    • AES depth profile studies of interdiffusion in the Ag-Cu bilyaer and multilayer thin films
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  • 16
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.