Self-forming AlOx layer as Cu diffusion barrier on porous low-k film

Thin Solid Films

Volumn 518, Issue 6, 2010, Pages 1648-1652

  Perng, Dung Ching ^a   Yeh, Jia Bin ^a   Hsu, Kuo Chung ^a   Tsai, Shuo Wen ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Copper; Diffusion barrier; Low k dielectrics; Porous materials; Self forming

Indexed keywords

AL ALLOY FILMS; AL-DOPING; AS-DEPOSITED FILMS; COPPER DIFFUSION; COPPER DIFFUSION BARRIER; COPPER INTERCONNECTS; COSPUTTERING; CU DIFFUSION BARRIER; INTER-DIFFUSION; LOW K DIELECTRICS; POROUS LOW-K; SI CONCENTRATION; ULTRA-THIN;

ALUMINUM; ANNEALING; DIFFUSION BARRIERS; LEAKAGE CURRENTS; POROUS MATERIALS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 73449097142     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.11.075     Document Type: Article

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