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Volumn 4, Issue 3, 2014, Pages 496-503

A wideband and compact EBG structure with a circular defected ground structure

Author keywords

Circular defected ground structure (CDGS); DGS; dispersion analysis; electromagnetic bandgap (EBG); power ground (P G) noise; size reduction; stopband enhancement

Indexed keywords

METAMATERIALS; PIECEWISE LINEAR TECHNIQUES; TRANSMISSION LINE THEORY;

EID: 84896395786     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2285407     Document Type: Article
Times cited : (26)

References (30)
  • 1
    • 4544321366 scopus 로고    scopus 로고
    • Power distribution networks for system-on-package: Status and challenges
    • May
    • M. Swaminathan, J. Kim, I. Novak, and J. P. Libous, "Power distribution networks for system-on-package: Status and challenges," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 286-300, May 2004.
    • (2004) IEEE Trans Adv. Packag. , vol.27 , Issue.2 , pp. 286-300
    • Swaminathan, M.1    Kim, J.2    Novak, I.3    Libous, J.P.4
  • 2
    • 77952744843 scopus 로고    scopus 로고
    • Overview of power integrity solutions on package and PCB: Decoupling and EBG isolation
    • May
    • T.-L. Wu, H.-H. Chuang, and T.-K. Wang, "Overview of power integrity solutions on package and PCB: Decoupling and EBG isolation," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 346-356, May 2010.
    • (2010) IEEE Trans Electromagn. Compat. , vol.52 , Issue.2 , pp. 346-356
    • Wu, T.-L.1    Chuang, H.-H.2    Wang, T.-K.3
  • 3
    • 33744549280 scopus 로고    scopus 로고
    • Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards
    • DOI 10.1109/TEMC.2006.873865
    • J. Kim, M. D. Rotaru, S. Baek, J. Park, M. K. Iyer, and J. Kim, "Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards," IEEE Trans. Electromagn. Compat., vol. 48, no. 2, pp. 319-330, May 2006. (Pubitemid 43811378)
    • (2006) IEEE Transactions on Electromagnetic Compatibility , vol.48 , Issue.2 , pp. 319-330
    • Kim, J.1    Rotaru, M.D.2    Baek, S.3    Park, J.4    Iyer, M.K.5    Kim, J.6
  • 5
    • 36348967803 scopus 로고    scopus 로고
    • Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method
    • DOI 10.1109/TADVP.2007.901764
    • T. K. Wang, S. T. Chen, C. W. Tsai, S. M. Wu, J. L. Drewniak, and T. L. Wu, "Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method," IEEE Trans. Adv. Packag., vol. 30, no. 4, pp. 864-871, Nov. 2007. (Pubitemid 350148411)
    • (2007) IEEE Transactions on Advanced Packaging , vol.30 , Issue.4 , pp. 864-871
    • Wang, T.-K.1    Chen, S.-T.2    Tsai, C.-W.3    Wu, S.-M.4    Drewniak, J.L.5    Wu, T.-L.6
  • 6
    • 77952744147 scopus 로고    scopus 로고
    • Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects
    • May
    • E.-P. Li, X.Wei, A. C. Cangellaris, E.-X. Liu, Y.-J. Zhang, M. D'Amore, et al., "Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 248-265, May 2010.
    • (2010) IEEE Trans. Electromagn. Compat. , vol.52 , Issue.2 , pp. 248-265
    • Li, E.-P.1    Wei, X.2    Cangellaris, A.C.3    Liu, E.-X.4    Zhang, Y.-J.5    D'Amore, M.6
  • 7
    • 20444403734 scopus 로고    scopus 로고
    • Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs
    • DOI 10.1109/TADVP.2005.846932
    • J. Lee, M. D. Rotaru, M. K. Iyer, H. Kim, and J. Kim, "Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs," IEEE Trans. Adv. Packag., vol. 28, no. 2, pp. 298-309, May 2005. (Pubitemid 40794332)
    • (2005) IEEE Transactions on Advanced Packaging , vol.28 , Issue.2 , pp. 298-309
    • Lee, J.1    Rotaru, M.D.2    Iyer, M.K.3    Kim, H.4    Kim, J.5
  • 8
    • 0038614784 scopus 로고    scopus 로고
    • Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits
    • Jun.
    • R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003.
    • (2003) IEEE Trans. Microw. Theory Tech. , vol.51 , Issue.6 , pp. 1629-1639
    • Abhari, R.1    Eleftheriades, G.V.2
  • 9
    • 0037250704 scopus 로고    scopus 로고
    • A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
    • Jan.
    • T. Kamgaing and O. M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microw. Wireless Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003.
    • (2003) IEEE Microw. Wireless Compon. Lett. , vol.13 , Issue.1 , pp. 21-23
    • Kamgaing, T.1    Ramahi, O.M.2
  • 10
    • 24344487238 scopus 로고    scopus 로고
    • Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes
    • DOI 10.1109/TMTT.2005.852776
    • S. D. Rogers, "Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes," IEEE Trans. Microw. Theory Tech., vol. 53, no. 8, pp. 2495-2505, Aug. 2005. (Pubitemid 41259466)
    • (2005) IEEE Transactions on Microwave Theory and Techniques , vol.53 , Issue.8 , pp. 2495-2505
    • Rogers, S.D.1
  • 11
    • 18744364743 scopus 로고    scopus 로고
    • Miniaturised electromagnetic bandgap structures for broadband switching noise suppression in PCBs
    • DOI 10.1049/el:20050445
    • S. Shahparnia and O. M. Ramahi, "Miniaturized electromagnetic bandgap structures for broadband switching noise suppression in PCBs," Electron. Lett., vol. 41, no. 9, pp. 519-520, Apr. 2005. (Pubitemid 40672620)
    • (2005) Electronics Letters , vol.41 , Issue.9 , pp. 519-520
    • Shahparnia, S.1    Ramahi, O.M.2
  • 12
    • 25144490014 scopus 로고    scopus 로고
    • High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions
    • DOI 10.1109/LMWC.2005.852779
    • J. Lee, H. Kim, and J. Kim, "High dielectric constant thin film EBG power/ground network for broadband suppression of SSN and radiated emissions," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 8, pp. 505-507, Jan. 2003. (Pubitemid 41343381)
    • (2005) IEEE Microwave and Wireless Components Letters , vol.15 , Issue.8 , pp. 505-507
    • Lee, J.1    Kim, H.2    Kim, J.3
  • 13
    • 34047177430 scopus 로고    scopus 로고
    • A power plane with wideband SSN suppression using a multi-via electromagnetic bandgap structure
    • DOI 10.1109/LMWC.2007.892992
    • M. S. Zhang, Y. S. Li, C. Jia, and L. P. Li, "A power plane with wideband SSN suppression using a multi-via electromagnetic bandgap structure," IEEE Microw. Wireless Compon. Lett., vol. 17, no. 4, pp. 307-309, Apr. 2007. (Pubitemid 46527378)
    • (2007) IEEE Microwave and Wireless Components Letters , vol.17 , Issue.4 , pp. 307-309
    • Zhang, M.-S.1    Li, Y.-S.2    Jia, C.3    Li, L.-P.4
  • 14
    • 77955516299 scopus 로고    scopus 로고
    • A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: Modeling and application in RF-SiP
    • Aug.
    • C.-Y. Hsieh, C.-D. Wang, K.-Y. Lin, and T.-L. Wu, "A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: Modeling and application in RF-SiP," IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 582-591, Aug. 2010.
    • (2010) IEEE Trans Adv. Packag. , vol.33 , Issue.3 , pp. 582-591
    • Hsieh, C.-Y.1    Wang, C.-D.2    Lin, K.-Y.3    Wu, T.-L.4
  • 15
    • 33748337747 scopus 로고    scopus 로고
    • Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications
    • DOI 10.1109/LMWC.2006.880719, 1683799
    • J. Park, A. C. W. Lu, K. M. Chua, L. L. Wai, J. Lee, and J. Kim, "Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP application," IEEE Microw. Wireless Compon., Lett., vol. 16, no. 9, pp. 481-483, Sep. 2006. (Pubitemid 44335225)
    • (2006) IEEE Microwave and Wireless Components Letters , vol.16 , Issue.9 , pp. 481-483
    • Park, J.1    Lu, A.C.W.2    Chua, K.M.3    Wai, L.L.4    Lee, J.5    Kim, J.6
  • 16
    • 34948820214 scopus 로고    scopus 로고
    • A double-surface electromagnetic bandgap structure with one surface embedded in power plane for ultra-wideband SSN suppression
    • DOI 10.1109/LMWC.2007.905601
    • M.-S. Zhang, Y.-S. Li, C. Jia, L.-P. Li, and J. Pan, "A double-surface electromagnetic bandgap structure with one surface embedded in power plane for ultra-wideband ssn suppression," IEEE Microw. Wireless Compon. Lett., vol. 17, no. 10, pp. 706-708, Oct. 2007. (Pubitemid 47525342)
    • (2007) IEEE Microwave and Wireless Components Letters , vol.17 , Issue.10 , pp. 706-708
    • Zhang, M.-S.1    Li, Y.-S.2    Jia, C.3    Li, L.-P.4    Pan, J.5
  • 17
    • 84873988002 scopus 로고    scopus 로고
    • Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression
    • Feb.
    • C.-D. Wang and T.-L. Wu, "Model and Mechanism of Miniaturized and Stopband-Enhanced Interleaved EBG Structure for Power/Ground Noise Suppression," IEEE Trans. Electromagn. Compat., vol. 55, no. 1, pp. 159-167, Feb. 2013.
    • (2013) IEEE Trans Electromagn. Compat. , vol.55 , Issue.1 , pp. 159-167
    • Wang, C.-D.1    Wu, T.-L.2
  • 18
    • 84862827001 scopus 로고    scopus 로고
    • A compact and wideband electromagnetic bandgap structure using a defected ground structure for power/ground noise suppression in multilayer packages and PCBs
    • Jun.
    • M. Kim, K. Koo, C. Hwang, Y. Shim, J. Kim, and J. Kim, "A compact and wideband electromagnetic bandgap structure using a defected ground structure for power/ground noise suppression in multilayer packages and PCBs," IEEE Trans. Electromagn. Compat., vol. 54, no. 3, pp. 689-695, Jun. 2012.
    • (2012) IEEE Trans Electromagn. Compat. , vol.54 , Issue.3 , pp. 689-695
    • Kim, M.1    Koo, K.2    Hwang, C.3    Shim, Y.4    Kim, J.5    Kim, J.6
  • 19
    • 80054738944 scopus 로고    scopus 로고
    • Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP
    • Aug.
    • C.-D. Wang and T.-L. Wu, "Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP," in Proc. IEEE EMC Symp., Aug. 2011, pp. 715-719.
    • Proc. IEEE EMC Symp. , vol.2011 , pp. 715-719
    • Wang, C.-D.1    Wu, T.-L.2
  • 20
    • 4444312216 scopus 로고    scopus 로고
    • Dispersion analysis of the shielded Sievenpiper structure using multiconductor transmission-line theory
    • Sep.
    • F. Elek and G. V. Eleftheriades, "Dispersion analysis of the shielded Sievenpiper structure using multiconductor transmission-line theory," IEEE Microw. Wireless Compon. Lett., vol. 14, no. 9, pp. 434-436, Sep. 2004.
    • (2004) IEEE Microw. Wireless Compon. Lett. , vol.14 , Issue.9 , pp. 434-436
    • Elek, F.1    Eleftheriades, G.V.2
  • 21
    • 34047211015 scopus 로고    scopus 로고
    • Stopband prediction with dispersion diagram for electromagnetic bandgap structures in printed circuit boards
    • Y. Toyota, E. Engin, T. Kim, M. Swaminathan, and K. Uriu, "Stopband prediction with dispersion diagram for electromagnetic bandgap structures in printed circuit boards," in Proc. IEEE EMC Symp., Aug. 2006, pp. 807-811.
    • Proc. IEEE EMC Symp., Aug. , vol.2006 , pp. 807-811
    • Toyota, Y.1    Engin, E.2    Kim, T.3    Swaminathan, M.4    Uriu, K.5
  • 22
    • 27144460896 scopus 로고    scopus 로고
    • A simple and effective model for electromagnetic bandgap structures embedded in printed circuit boards
    • DOI 10.1109/LMWC.2005.856695
    • S. Shahparnia and O. M. Ramahi, "A simple and effective model for electromagnetic band gap structures embedded in printed circuit boards," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 10, pp. 621-623, Oct. 2005. (Pubitemid 41495081)
    • (2005) IEEE Microwave and Wireless Components Letters , vol.15 , Issue.10 , pp. 621-623
    • Shahparnia, S.1    Ramahi, O.M.2
  • 23
    • 79951949983 scopus 로고    scopus 로고
    • A wideband and compact partial electromagnetic bandgap structure with a narrow via pitch for a signal via shield
    • Feb.
    • C. Hwang, J. Kim, E. Song, Y. Shim, and J. Kim, "A wideband and compact partial electromagnetic bandgap structure with a narrow via pitch for a signal via shield," IEEE Trans. Electromagn. Compat., vol. 53, no. 1, pp. 241-244, Feb. 2011.
    • (2011) IEEE Trans Electromagn. Compat. , vol.53 , Issue.1 , pp. 241-244
    • Hwang, C.1    Kim, J.2    Song, E.3    Shim, Y.4    Kim, J.5
  • 24
    • 33845524638 scopus 로고    scopus 로고
    • Stopband analysis using dispersion diagram for two-dimensional electromagnetic bandgap structures in printed circuit boards
    • DOI 10.1109/LMWC.2006.885587
    • Y. Toyota, A. E. Engin, T. Kim, and M. Swaminathan, "Stopband analysis using dispersion diagram for two-dimensional electromagnetic bandgap structures in printed circuit boards," IEEE Microw. Wireless Compon. Lett., vol. 16, no. 12, pp. 645-647, Dec. 2006. (Pubitemid 44925835)
    • (2006) IEEE Microwave and Wireless Components Letters , vol.16 , Issue.12 , pp. 645-647
    • Toyota, Y.1    Engin, A.E.2    Kim, T.H.3    Swaminathan, M.4
  • 26
    • 33947139764 scopus 로고    scopus 로고
    • Locally resonant cavity cell model for electromagnetic band gap structures
    • DOI 10.1109/TAP.2005.861532
    • L. Li, B. Li, H. X. Liu, and C. H. Liang, "Locally resonant cavity cell model for electromagnetic band gap structures," IEEE Trans. Antennas Propag., vol. 54, no. 1, pp. 90-100, Jan. 2006. (Pubitemid 46401699)
    • (2006) IEEE Transactions on Antennas and Propagation , vol.54 , Issue.1 , pp. 90-100
    • Li, L.1    Li, B.2    Liu, H.-X.3    Liang, C.-H.4
  • 28
    • 0030779318 scopus 로고    scopus 로고
    • An efficient method for analysis of arbitrary nonuniform transmission lines
    • PII S0018948097002603
    • K. Lu, "An efficient method for analysis of arbitrary nonuniform transmission lines," IEEE Trans. Microw. Theory Tech., vol. 45, no. 1, pp. 9-14, Jan. 1997. (Pubitemid 127828078)
    • (1997) IEEE Transactions on Microwave Theory and Techniques , vol.45 , Issue.1 , pp. 9-14
    • Lu, K.1
  • 29
    • 33847721493 scopus 로고    scopus 로고
    • A systematicdesign to suppress wideband ground bounce noise in high-speed circuitsby electromagnetic-bandgap-enhanced split powers
    • Dec
    • C.-L. Wang, G.-H. Shiue, W.-D. Guo, and R.-B. Wu, "A systematicdesign to suppress wideband ground bounce noise in high-speed circuitsby electromagnetic-bandgap-enhanced split powers," IEEE Trans. Microw. Theory Tech., vol. 54, no. 12, pp. 4209-4217, Dec. 2006.
    • (2006) IEEE Trans. Microw. Theory Tech. , vol.54 , Issue.12 , pp. 4209-4217
    • Wang, C.-L.1    Shiue, G.-H.2    Guo, W.-D.3    Wu, R.-B.4


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