Stopband prediction with dispersion diagram for electromagnetic bandgap structures in printed circuit boards

IEEE International Symposium on Electromagnetic Compatibility

Volumn 3, Issue , 2006, Pages 807-811

  Toyota, Yoshitaka ^a   Engin, Arif Ege ^b   Kim, Tae Hong ^b   Swaminathan, Madhavan ^b   Uriu, Kazuhide ^c  

^a OKAYAMA UNIVERSITY   (Japan)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC DISPERSION; ELECTROMAGNETIC WAVES; PERIODIC STRUCTURES; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE; TWO DIMENSIONAL;

DISPERSION-DIAGRAM ANALYSIS; ELECTROMAGNETIC SIMULATION; SWITCHING NOISE;

ENERGY GAP;

EID: 34047211015     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/isemc.2006.1706421     Document Type: Conference Paper

References (13)

1. J. Choi, V. Govind, and M. Swaminathan, "A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications," in Proc. IEEE Radio and Wireless Conf., Atlanta, GA, Sep. 2004, pp. 243-246.
2. J. Choi, V. Govind, M. Swaminathan, L. Wan, and R. Doraiswami, "Isolation in mixed-signal systems using a novel electromagnetic bandgap (EBG) Structure," in IEEE 13th Topical Meeting Electr. Performance Electron. Packag., Portland, OR, Oct. 2004, pp. 199-202.
3. T. Kamgaing and O. M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microw. Wireless Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003.
4. S. Shahparnia and O. M. Ramahi, "Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures," IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 580-587, Nov. 2004.
5. Y. Toyota, A. E. Engin, T. H. Kim, M. Swaminathan, and S. Bhattacharya, "Size Reduction of Electromagnetic Bandgap (EBG) Structures with New Geometries and Materials" in Proc. 56th Electron. Compon. Technol. Conf., San Diego, CA, Jun. 2006.
6. A. Sanada, C. Caloz, and T. Itoh, "Characteristics of the composite right/left-handed transmission lines," IEEE Microw. Wireless Compon. Lett., vol. 14, no. 2, pp. 68-70, Feb. 2004.
7. F. Elek and G. V. Eleftheriades, "A two-dimensional uniplanar transmission-line metamaterial with a negative index of refraction," New J. Phys., Vol. 7, No. 163, 2005.
8. S. D. Rogers, "Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes," IEEE Trans. Microw. Theory Tech., vol. 53, no. 8, pp. 2495-2505, Aug. 2005.
9. T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, "Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise and Radiated Emission in High-Speed Circuits," IEEE Trans. Microw. Theory Tech., vol. 53, no. 9, pp. 2935-2942, Sep. 2005.
10. S. Shahparnia and O. M. Ramahi, "A Simple and Effective Model for Electromagnetic Bandgap Structures Embedded in Printed Circuit Boards," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 10, pp. 621-623, Oct. 2005.
11. R. E. Collin, Foundations for Microwave Engineering, 2nd ed. New York: McGraw-Hill, 1992, pp. 550-566.
12. A. E. Engin, M. Swaminathan, and Y. Toyota, "Finite difference modeling of multiple planes in packages," in Proc. 17th Int. Zurich Symp. Electromagn. Compat., Singapore, Mar. 2006, pp. 549-552.
13. J. Kim and M. Swaminathan, "Modeling of irregular shaped power distribution planes using transmission matrix method," IEEE Trans. Adv. Packag., vol. 24, no. 3, pp. 334-346, Aug. 2001.