A compact and wideband electromagnetic bandgap structure using a defected ground structure for power/ground noise suppression in multilayer packages and PCBs

IEEE Transactions on Electromagnetic Compatibility

Volumn 54, Issue 3, 2012, Pages 689-695

  Kim, Myunghoi ^a   Koo, Kyoungchoul ^a   Hwang, Chulsoon ^a   Shim, Yujeong ^a   Kim, Joungho ^a   Kim, Jonghoon ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Defected ground structure; electromagnetic bandgap; package; power ground noise; printed circuit board

Indexed keywords

DISPERSION CHARACTERISTICS; EBG STRUCTURE; ELECTROMAGNETIC BAND GAPS; ELECTROMAGNETIC BANDGAP STRUCTURES; GEOMETRICAL PARAMETERS; GROUND PLANES; MULTILAYER PACKAGE; NOISE COUPLING; NOISE SUPPRESSION; PACKAGE; POWER/GROUND NOISE; WIDE-BAND;

DEFECTED GROUND STRUCTURES; METAMATERIALS; MULTILAYERS; POLYCHLORINATED BIPHENYLS;

PRINTED CIRCUIT BOARDS;

EID: 84862827001     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2012.2187662     Document Type: Article

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