-
2
-
-
4544321366
-
"Power distribution networks for system-on-package: Status and challenges"
-
May
-
M. Swaminathan, J. Kim, I. Novak, and J. P. Libous, "Power distribution networks for system-on-package: Status and challenges," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 286-300, May 2004.
-
(2004)
IEEE Trans. Adv. Packag.
, vol.27
, Issue.2
, pp. 286-300
-
-
Swaminathan, M.1
Kim, J.2
Novak, I.3
Libous, J.P.4
-
3
-
-
0029708648
-
"Measurement and simulation of simultaneous switching noise in the multi-reference plane package"
-
May 28-31
-
S. G. Rosser, M. K. Kerr, C. S. Chang, J. Fang, Z. Chen, and Y. Chen, "Measurement and simulation of simultaneous switching noise in the multi-reference plane package," in Proc. IEEE Electron. Compon. Technol. Conf., May 28-31, 1996, pp. 660-670.
-
(1996)
Proc. IEEE Electron. Compon. Technol. Conf.
, pp. 660-670
-
-
Rosser, S.G.1
Kerr, M.K.2
Chang, C.S.3
Fang, J.4
Chen, Z.5
Chen, Y.6
-
4
-
-
0033680026
-
"EMI resulting from signal via transitions through the DC power bus"
-
Aug. 21-25
-
W. Cui, X. Ye, B. Archambeault, D. White, M. Li, and J. L. Drewniak, "EMI resulting from signal via transitions through the DC power bus," in Proc. IEEE Int. Symp. EMC, vol. 2, Aug. 21-25, 2000, pp. 821-826.
-
(2000)
Proc. IEEE Int. Symp. EMC
, vol.2
, pp. 821-826
-
-
Cui, W.1
Ye, X.2
Archambeault, B.3
White, D.4
Li, M.5
Drewniak, J.L.6
-
5
-
-
0036385145
-
"Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB"
-
Aug. 19-23
-
J.-N. Hwang and T.-L. Wu, "Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB," in Proc. IEEE Int. Symp. EMC, vol. 2, Aug. 19-23, 2002, pp. 733-736.
-
(2002)
Proc. IEEE Int. Symp. EMC
, vol.2
, pp. 733-736
-
-
Hwang, J.-N.1
Wu, T.-L.2
-
6
-
-
0036297056
-
"Simulation of a coupled signal and power delivery system in an electronics package"
-
May 28-31
-
Q. Qi, D. Quint, and T. Michalka, "Simulation of a coupled signal and power delivery system in an electronics package," in Proc. 52nd IEEE Electron. Compon. Technol. Conf., May 28-31, 2002, pp. 311-318.
-
(2002)
Proc. 52nd IEEE Electron. Compon. Technol. Conf.
, pp. 311-318
-
-
Qi, Q.1
Quint, D.2
Michalka, T.3
-
7
-
-
0035329204
-
"Modeling of simultaneous switching noise in high speed systems"
-
May
-
S. Chun, M. Swaminathan, L. Smith, J. Srinivasan, Z. Jin, and M. K. Iyer, "Modeling of simultaneous switching noise in high speed systems," IEEE Trans. Adv. Packag., vol. 24, no. 2, pp. 132-142, May 2001.
-
(2001)
IEEE Trans. Adv. Packag.
, vol.24
, Issue.2
, pp. 132-142
-
-
Chun, S.1
Swaminathan, M.2
Smith, L.3
Srinivasan, J.4
Jin, Z.5
Iyer, M.K.6
-
8
-
-
0035786813
-
"Capturing via effects in simultaneous switching noise simulation"
-
Aug. 13-17
-
S. Chun, J. Choi, S. Dalmia, W. Kim, and M. Swaminathan, "Capturing via effects in simultaneous switching noise simulation," in Proc. IEEE Int. Symp. EMC, vol. 2, Aug. 13-17, 2001, pp. 1221-1226.
-
(2001)
Proc. IEEE Int. Symp. EMC
, vol.2
, pp. 1221-1226
-
-
Chun, S.1
Choi, J.2
Dalmia, S.3
Kim, W.4
Swaminathan, M.5
-
11
-
-
0034239323
-
"Modeling and transient simulation of planes in electronic packages"
-
Aug
-
N. Na, J. Choi, S. Chun, M. Swaminathan, and J. Srinivasan, "Modeling and transient simulation of planes in electronic packages," IEEE Trans. Adv. Packag., vol. 23, no. 3, pp. 340-352, Aug. 2000.
-
(2000)
IEEE Trans. Adv. Packag.
, vol.23
, Issue.3
, pp. 340-352
-
-
Na, N.1
Choi, J.2
Chun, S.3
Swaminathan, M.4
Srinivasan, J.5
-
13
-
-
0026908091
-
"S-Parameter-based IC interconnect transmission line characterization"
-
Aug
-
W. R. Eisenstadt and Y. Eo, "S-Parameter-based IC interconnect transmission line characterization," IEEE Trans. Compon., Hybrids, Manuf. Technol., vol. 15, no. 4, pp. 483-490, Aug. 1992.
-
(1992)
IEEE Trans. Compon., Hybrids, Manuf. Technol.
, vol.15
, Issue.4
, pp. 483-490
-
-
Eisenstadt, W.R.1
Eo, Y.2
-
15
-
-
4644258794
-
"Efficiency of differential signaling on cavity noise suppression in applications with reference plane change"
-
Aug. 9-13
-
J. Lee, A. C. W. Lu, W. Fan, L. L. Wai, J. Kim, and J. Kim, "Efficiency of differential signaling on cavity noise suppression in applications with reference plane change," in Proc. IEEE Int. Symp. EMC, vol. 1, Aug. 9-13, 2004, pp. 203-208.
-
(2004)
Proc. IEEE Int. Symp. EMC
, vol.1
, pp. 203-208
-
-
Lee, J.1
Lu, A.C.W.2
Fan, W.3
Wai, L.L.4
Kim, J.5
Kim, J.6
-
16
-
-
4644318460
-
"Via and reference discontinuity impact on high-speed signal integrity"
-
J. Kim, M. D. Rotaru, K. C. Chong, M. K. Iyer, and J. Kim, "Via and reference discontinuity impact on high-speed signal integrity," in Proc. Int. Symp. EMC, 2004, pp. 583-587.
-
(2004)
Proc. Int. Symp. EMC
, pp. 583-587
-
-
Kim, J.1
Rotaru, M.D.2
Chong, K.C.3
Iyer, M.K.4
Kim, J.5
-
17
-
-
0003622532
-
-
Englewood Cliffs, NJ: Prentice-Hall, Appendix C
-
H. W. Johnson and M. Graham, High-Speed Digital Design, Englewood Cliffs, NJ: Prentice-Hall, 1993, Appendix C., pp. 257-259.
-
(1993)
High-Speed Digital Design
, pp. 257-259
-
-
Johnson, H.W.1
Graham, M.2
-
19
-
-
4544226060
-
"Electromagnetic interference (EMI) of system-on-package (SOP)"
-
May
-
T. Sudo, H. Sasaki, N. Masuda, and J. L. Drewniak, "Electromagnetic interference (EMI) of system-on-package (SOP)," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 304-314, May 2004.
-
(2004)
IEEE Trans. Adv. Packag.
, vol.27
, Issue.2
, pp. 304-314
-
-
Sudo, T.1
Sasaki, H.2
Masuda, N.3
Drewniak, J.L.4
-
20
-
-
28444445281
-
"Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards"
-
Nov
-
J. Kim, H. Lee, and J. Kim, "Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards," IEEE Trans. Adv. Packag., vol. 28, no. 4, pp. 724-735, Nov. 2005.
-
(2005)
IEEE Trans. Adv. Packag.
, vol.28
, Issue.4
, pp. 724-735
-
-
Kim, J.1
Lee, H.2
Kim, J.3
-
21
-
-
0038618708
-
"Application of the cavity model to lossy power-return plane structures in printed circuit boards"
-
Feb
-
M. Xu, H. Wang, and T. H. Hubing, "Application of the cavity model to lossy power-return plane structures in printed circuit boards," IEEE Trans. Adv. Packag., vol. 26, no. 1, pp. 73-80, Feb. 2003.
-
(2003)
IEEE Trans. Adv. Packag.
, vol.26
, Issue.1
, pp. 73-80
-
-
Xu, M.1
Wang, H.2
Hubing, T.H.3
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