Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 4, 2007, Pages 864-871

  Wang, Ting Kuang ^a   Chen, Sin Ting ^b   Tsai, Chi Wei ^b   Wu, Sung Mao ^c,d   Drewniak, James L ^e   Wu, Tzong Lin ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b ASUSTEK COMPUTER INC   (Taiwan)

^c ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^d NATIONAL UNIVERSITY OF KAOHSIUNG   (Taiwan)

^e University of Missouri Rolla   (United States)

Author keywords

Ball grid array (BGA); Print circuit board (PCB); Signal integrity (SI); Simultaneous switching noise (SSN); Two dimensional (2 D) finite difference time domain (FDTD) modeling

Indexed keywords

BALL GRID ARRAYS; COMPUTER SIMULATION; FINITE DIFFERENCE TIME DOMAIN METHOD; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE;

SIGNAL INTEGRITY; SIMULTANEOUS SWITCHING NOISE;

ELECTRONICS PACKAGING;

EID: 36348967803     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.901764     Document Type: Article

References (20)

1. A. R. Djordjevic and T. K. Sarkar, "An investigation of delta-I noise on integrated circuits," IEEE Trans. Electromagn. Compat., vol. 35, no. 2, pp. 134-147, May 1993.
2. S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W. Temmerman, "Study of the ground bounce caused by power plane resonances," IEEE Trans. Electromagn. Compat., vol. 40, no. 2, pp. 111-119, May 1998.
3. G. Lei, R. W. Techentin, and B. K. Bilbert, "High-frequency characterization of power/ground-plane structures," IEEE Trans. Microw. Theory Tech., vol. 47, no. 5, pp. 562-569, May 1999.
4. S. Chun, M. Swaminathan, L. D. Smith, J. S. Z. Jin, and M. K. Iyer, "Modeling of simultaneous switching noise in high speed systems," IEEE Trans. Adv. Packag., vol. 24, no. 2, pp. 132-142, May 2001.
5. E. R. Pillai, "Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling," IEEE Trans. Microw. Theory Tech., vol. 45, no. 10, pp. 1981-1985, Oct. 1997.
6. G. Cerri, R. De Leo, and V. M. Primian, "A rigorous model for radiated emission prediction in PCB circuits," IEEE Trans. Electromagn. Compat., vol. 35, no. 1, pp. 102-109, Feb. 2001.
7. W. Pinello, A. C. Cangellaris, and A. Ruehli, "Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent circuit formulation," IEEE Trans. Microw. Theory Tech., vol. 45, no. 10, pp. 1889-1896, Oct. 1997.
8. B. Archambeault and A. E. Ruehli, "Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique," IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 437-445, Nov. 2001.
9. W. D. Becker and R. Mittra, "FDTD modeling of noise in computer package," IEEE Trans. Compon., Packag., Manuf. Technol., B, vol. 17, no. 3, pp. 240-247, Aug. 1994.
10. X. Ye, M. Y. Koledintseva, M. I., and J. L. Drewniak, "DC power-bus design using FDTD modeling with dispersive media and surface mount technology components," IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 579-587, Nov. 2001.
11. N. Na, J. Choi, S. Chun, M. Swaminathan, and J. Srinivasan, "Modeling and transient simulation of planes in electronic packages," IEEE Trans. Adv. Packag., vol. 23, no. 3, pp. 340-352, Aug. 2000.
12. Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes," IEEE Trans. Electromagn. Compat., vol. 47, no. 1, pp. 2-9, Feb. 2005.
13. H. H.Wu, J.W.Meyer, K. Lee, and A. Barber, "Accurate power supply and ground plane pair models," IEEE Trans. Adv. Packag., vol. 22, no. 3, pp. 259-266, Aug. 1999.
14. O. M. Ramahi, V. Subramanian, and B. Archambeault, "A simple finite-difference frequency-domain (FDFD) algorithm for analysis of switching noise in printed circuit boards and packages," IEEE Trans. Adv. Packag., vol. 26, no. 2, pp. 191-198, May 2003.
15. W. Sui, D. A. Christensen, and C. H. Durney, "Extending the two-dimensional FDTD method to hybrid electromagnetic systems with active and passive lumped elements," IEEE Trans. Microw. Theory Tech., vol. 40, pp. 724-730, Apr. 1992.
16. M. Piket-May, A. Taflove, and J. Baron, "FD-TD modeling of digital signal propagation in 3-D circuits with passive and active loads," IEEE Trans. Microw. Theory Tech., vol. 42, no. 8, pp. 1514-1523, Aug. 1994.
17. T.-L. Wu, S.-T. Chen, and Y.-S. Huang, "A novel approach for the incorporation of arbitrary linear lumped network into FDTD method," IEEE Microw. Wireless Compon. Lett., vol. 14, no. 2, pp. 74-76, Feb. 2004.
18. J. Fan, W. Cui, J. L. Drewniak, T. P. Van Doren, and J. L. Knighten, "Estimating the noise mitigation effect of local decoupling in printed circuit boards," IEEE Trans. Adv. Packag., vol. 25, no. 2, pp. 154-165, May 2002.
19. S. H. Hall, G. W. Hall, and J. A. McCall, High-Speed Digital System Design. New York: Wiley, 2000.
20. F. W. Grover, Inductance Calculations: Working Formulas and Tables New York: Dover, 1946.