A wideband and compact partial electromagnetic bandgap structure with a narrow via pitch for a signal via shield

IEEE Transactions on Electromagnetic Compatibility

Volumn 53, Issue 1, 2011, Pages 241-244

  Hwang, Chulsoon ^a   Kim, Jaemin ^a   Song, Eakhwan ^a   Shim, Yujeong ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Electromagnetic bandgap (EBG); partial EBG (PEBG); simultaneous switching noise (SSN); via shield

Indexed keywords

CAPACITANCE MODEL; COMPACT SIZE; ELECTROMAGNETIC BAND GAPS; ELECTROMAGNETIC BANDGAP STRUCTURES; ESTIMATION MODELS; EXPERIMENTAL MEASUREMENTS; HIGH FREQUENCY; MULTILAYER PRINTED CIRCUIT BOARD; PARTIAL EBG (PEBG); PHASE CONSTANTS; RESONANT CAVITY; SIMULTANEOUS SWITCHING NOISE; SIMULTANEOUS SWITCHING NOISE (SSN); STOPBAND; VIA SHIELD; WIDE STOPBAND; WIDE-BAND;

ELECTROMAGNETISM; ENERGY GAP; JITTER; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SWITCHING;

METAMATERIALS;

EID: 79951949983     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2010.2065234     Document Type: Article

References (4)

1. J. Park, H. Kim, Y. Jeong, J. Kim, J. S. Pak, D. G. Kam, and J. Kim, "Modeling and measurement of simultaneous switching noise coupling through signal via transition," IEEE Trans. Adv. Packag., vol. 29, no. 3, pp. 548-559, Aug. 2006. (Pubitemid 44263697)
2. W. McKinzie and S. Rogers, "Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards," U.S. Patent 7,215,007 B2, May 8, 2007.
3. S. D. Rogers, "Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes," IEEE Trans.Microw. Theory Tech., vol. 53, no. 8, pp. 2495-2505, Aug. 2005. (Pubitemid 41259466)
4. G. T. Lei, R.W. Techentin, and B. K. Gilbert, "High-frequency characterization of power/ground-plane structures," IEEE Trans. Microw. Theory Tech., vol. 47, no. 5, pp. 562-569, May 1999.