A double-surface electromagnetic bandgap structure with one surface embedded in power plane for ultra-wideband SSN suppression

IEEE Microwave and Wireless Components Letters

Volumn 17, Issue 10, 2007, Pages 706-708

  Zhang, Mu Shui ^a   Li, Yu Shan ^a   Jia, Chen ^a   Li, Li Ping ^a   Pan, Jian ^a  

^a XIDIAN UNIVERSITY   (China)

Author keywords

Electromagnetic bandgap (EBG); Printed circuit board (PCB); Simultaneous switching noise (SSN)

Indexed keywords

BROADBAND NETWORKS; ELECTROMAGNETIC WAVES; NOISE ABATEMENT; PRINTED CIRCUIT BOARDS; SWITCHING;

ELECTROMAGNETIC BANDGAP (EBG); METAL LAYER; SIMULTANEOUS SWITCHING NOISE (SSN);

ENERGY GAP;

EID: 34948820214     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2007.905601     Document Type: Article

References (8)

1. J. Park, H. Kim, Y. Jeong, J. Kim, J. S. Pak, D. G. Kam., and J. Kim, "Modeling and measurement of the SSN coupling through signal via transition," IEEE Trans. Adv. Packag., vol. 29, no. 3, pp. 548-559, Aug. 2006.
2. R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuit," IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003.
3. T. Kamgaing and O. M. Ramahi, "Design and modeling of high-impedance electromagnetic surface for switching noise suppression in power planes," IEEE Trans. Electromagn. Compat., vol. 47, no. 3, pp. 479-489, Aug. 2005.
4. J. Lee, H. Kim, and J. Kim, "Broadband suppression of simultaneous switching noise and radiated emissions using high-DK thin film, electromagnetic bandgap power distribution network, for high-speed digital PCB applications," in Proc IEEE Int. Symp Electromagn. Compat., Aug. 2005, vol. 3, pp. 967-970.
5. S. Shahparnia and O. M. Ramahi, "Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures," IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 580-586, Nov. 2006.
6. T. L. Wu, Y. Y. Lin, C. C. Wang, and S. T. Chen, "Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 53, no. 9, pp. 2935-2942, Sep. 2005.
7. T. L. Wu, C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, "A novel power plane with super-widerband elimination of ground bounce noise on high speed circuits," IEEE Microw. Wireless Compon., Lett., vol. 15, no. 3, pp. 174-176, Mar. 2005.
8. J. Park, A. C. W. Lu, K. M. Chua, L. L. Wai, J. Lee, and J. Kim, "Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP application," IEEE Microw. Wireless Compon., Lett., vol. 16, no. 9, pp. 481-483, Sep. 2006.