Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2011, Pages 715-719

  Wang, Chuen De ^a   Wu, Tzong Lin ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN CONCEPT; EBG STRUCTURE; ELECTROMAGNETIC BANDGAP STRUCTURES; MEASURED RESULTS; OUTPUT SPECTRUM; PACKAGE LEVELS; POWER DISTRIBUTION NETWORK; POWER NOISE; SIMULATION ENVIRONMENT; STOPBAND;

BANDWIDTH; COMPUTER SIMULATION; CUTOFF FREQUENCY; ELECTRIC NETWORK ANALYSIS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETISM; POWER AMPLIFIERS; PRINTED CIRCUIT BOARDS;

INTERNET PROTOCOLS;

EID: 80054738944     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2011.6038402     Document Type: Conference Paper

References (17)

1. T.-L. Wu, H.-H. Chuang, and T.-K. Wang, "Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 346-356, May 2010.
2. M. Swaminathan, and E. Engin, Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2008.
3. T. H. Hubing, J. L. Drewniak, T. P. Van Doren, and D. M. Hockanson, "Power bus decoupling on multilayer printed circuit boardsIEEE Trans. Electromagn. Compat., vol. 37, no. 2, pp. 155-166, May 1995.
4. J. Fan, M. Cocchini, B. Archambeault, J. L. Knighten, J. L. Drewniak, and S. Conner, "Noise coupling between signal and power/ground nets due to signal vias transitioning through power/ground plane pair," IEEE International Symposium on Electromagnetic Compatibility, Detroit, MI, August 18-22, 2008.
5. T.-L. Wu, S.-T. Chen, J.-N. Huang, and Y.-H. Lin, "Numerical and Experimental Investigation of Radiation Caused by the Switching Noise on the Partitioned DC Reference Planes of High Speed Digital PCB," IEEE Trans. Electromagn. Compat., vol. 46, no. 1, pp. 33-45, Feb. 2004.
6. J. Fan, J. L. Drewniak, J. L. Knighten, N. W. Smith, A. Orlandi,T. P. Van Doren, T. H. Hubing, and R. E. DuBroff, "Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs," IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 588-599, Nov. 2001. (Pubitemid 34091980)
7. T.-L. Wu, and S.-T. Chen, "A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuitIEEE Trans. Microw. Theory Tech., vol. 54, no. 8, pp. 3398-3406, Aug. 2006.
8. G.-Z. Wu, Y.-C. Chen, and T.-L. Wu, "Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise SuppressionIEEE Transactions on Advanced Packaging, vol. 33, no. 1, pp. 206-211, Feb. 2010.
9. T.-L. Wu, Y.-H. Lin, T.-K. Wang, C.-C. Wang, and S.-T. Chen, "Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 53, no. 9, pp. 2935-2942, Sep. 2005. (Pubitemid 41633217)
10. T.-L. Wu, Y.-H. Lin, and S.-T. Chen, "A novel power plane with super-wideband elimination of ground bounce noise on high speed circuitsIEEE Microw. Wireless Compon. Lett., vol. 15, no.3, pp. 174-176, Mar. 2005. (Pubitemid 40421606)
11. R. Abhari, and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003.
12. T. Kamgaing and O.M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability usinghighimpedance surface,"IEEE Microw. Wireless Compon. Lett., vol. 13,no. 1, pp. 21-23Jan. 2003.
13. C.-D. Wang, and T.-L. Wu, "A Stopband Enhanced EBG Power/ground Plane based on Via Location Design," IEEE CPMT Symposium Japan, Tokyo, Japan, Aug. 2010.
14. A.C. Scogna, C.-D.Wang, A. Orlandi, and T.-L.Wu,"Parallel-Plate Noise Suppression Using a Ground Surface Perturbation Lattice (GSPL) Structure", IEEE Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on, pp. 158-161, April 2010.
15. Shawn D. Rogers, "Electromagnetic-Bandgap Layers for Broad-Band Suppression of TEM Modes in Power Planes," IEEE Trans Microw. Theory Tech., vol. 53, no. 8, pp. 2495-2505, Aug. 2005. (Pubitemid 41259466)
16. nd ed. New York: Wiley, 1998.
17. J. T. Stauth, and S. R. Sanders, "Power Supply Rejection for Radio Frequency Amplifiers: Theory and Measurements" IEEE Trans. Microw. Theory Tech., vol. 55, no. 10, pp. 2043-2052, Oct. 2007.