A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface

IEEE Microwave and Wireless Components Letters

Volumn 13, Issue 1, 2003, Pages 21-23

  Kamgaing, Telesphor ^a,b   Ramahi, Omar M ^c  

^a MOTOROLA INC   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

High impedance surface (HIS); Power planes; Simultaneous switching noise (SSN)

Indexed keywords

BANDWIDTH; ELECTRIC IMPEDANCE; PRINTED CIRCUIT BOARDS; RESONANCE; SPURIOUS SIGNAL NOISE; SWITCHING SYSTEMS;

HIGH IMPEDANCE SURFACE (HIS);

CMOS INTEGRATED CIRCUITS;

EID: 0037250704     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2002.807713     Document Type: Article

References (5)

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