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Volumn 15, Issue 8, 2005, Pages 505-507

High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

Author keywords

Electromagnetic bandgap (EBG); Power distribution network impedance; Radiated emission; Simultaneous switching noise (SSN)

Indexed keywords

ACOUSTIC IMPEDANCE; DIELECTRIC PROPERTIES; MAGNETOELECTRIC EFFECTS; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE; THIN FILMS;

EID: 25144490014     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2005.852779     Document Type: Article
Times cited : (53)

References (6)
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    • T. Kamgaing and O. M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microw. Wireless Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003.
    • (2003) IEEE Microw. Wireless Compon. Lett. , vol.13 , Issue.1 , pp. 21-23
    • Kamgaing, T.1    Ramahi, O.M.2
  • 3
    • 0038614784 scopus 로고    scopus 로고
    • Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits
    • Jun.
    • R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microwave Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003.
    • (2003) IEEE Trans. Microwave Theory Tech. , vol.51 , Issue.6 , pp. 1629-1639
    • Abhari, R.1    Eleftheriades, G.V.2
  • 4
    • 15944428232 scopus 로고    scopus 로고
    • Miniaturized electromagnetic bandgap structures for ultra-wide band switching noise mitigation in high-speed printed circuit boards and packages
    • Portland, OR, Oct. 25-27
    • S. Shahparnia and O. M. Ramahi, "Miniaturized electromagnetic bandgap structures for ultra-wide band switching noise mitigation in high-speed printed circuit boards and packages," in Proc. IEEE 13th Topical Meeting Electrical Performance Electronic Packaging, Portland, OR, Oct. 25-27, 2004, pp. 211-214.
    • (2004) Proc. IEEE 13th Topical Meeting Electrical Performance Electronic Packaging , pp. 211-214
    • Shahparnia, S.1    Ramahi, O.M.2
  • 5
    • 1642402127 scopus 로고    scopus 로고
    • Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs
    • Feb.
    • H. Kim, B. K. Sun, and J. Kim, "Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs," IEEE Microw. Wireless Compon. Lett., vol. 14, no. 2, pp. 71-74, Feb. 2004.
    • (2004) IEEE Microw. Wireless Compon. Lett. , vol.14 , Issue.2 , pp. 71-74
    • Kim, H.1    Sun, B.K.2    Kim, J.3
  • 6
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    • Modeling and transient simulation of planes in electronic packages
    • Aug.
    • N. Na, J. Choi, S. Chun, M. Swaminathan, and J. Srinivasan, "Modeling and transient simulation of planes in electronic packages," IEEE Trans. Adv. Packag., vol. 23, no. 3, pp. 340-352, Aug. 2000.
    • (2000) IEEE Trans. Adv. Packag. , vol.23 , Issue.3 , pp. 340-352
    • Na, N.1    Choi, J.2    Chun, S.3    Swaminathan, M.4    Srinivasan, J.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.