Review of the potential of the Ni/Cu plating technique for crystalline silicon solar cells

Materials

Volumn 7, Issue 2, 2014, Pages 1318-1341

  ur Rehman, Atteq ^a   Lee, Soo Hong ^a  

^a Sejong University   (South Korea)

Author keywords

adhesion; Contact resistance; Efficiency; Light induced plating (LIP); Metal plating; Metallization; Nickel copper; Photovoltaic; Screen printing; Solar cell

Indexed keywords

EID: 84894857437     PISSN: None     EISSN: 19961944     Source Type: Journal    
DOI: 10.3390/ma7021318     Document Type: Review

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